JPS5586120A - Grinding method for semiconductor wafer - Google Patents

Grinding method for semiconductor wafer

Info

Publication number
JPS5586120A
JPS5586120A JP15905778A JP15905778A JPS5586120A JP S5586120 A JPS5586120 A JP S5586120A JP 15905778 A JP15905778 A JP 15905778A JP 15905778 A JP15905778 A JP 15905778A JP S5586120 A JPS5586120 A JP S5586120A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
grinding
slurry
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15905778A
Other languages
Japanese (ja)
Inventor
Yoshinobu Tsujikawa
Katsunobu Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Monsanto Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Monsanto Chemical Co filed Critical Mitsubishi Monsanto Chemical Co
Priority to JP15905778A priority Critical patent/JPS5586120A/en
Publication of JPS5586120A publication Critical patent/JPS5586120A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To grind a semiconductor wafer by such manner as covering the face of a holder in contact with the wafer with a given matter and pressing it against a rotary table.
CONSTITUTION: Alumina or the like with grade 3000 or so is suspended to a slurry in water or that in which glycerol is mixed i small quantities and then supplied to a device. The face of a holder 4 mounted on a rotatable spindle 3 which comes in contact with a wafer is covered with polyurethane foam 5 the front layer of which is polyurethane having a suede surface. Since the surface is moistened with slurry, this matter is effective enough to hold the wafer closely at the time of grinding. According to this method, it is not necessary to wash out an adhesive after grinding.
COPYRIGHT: (C)1980,JPO&Japio
JP15905778A 1978-12-22 1978-12-22 Grinding method for semiconductor wafer Pending JPS5586120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15905778A JPS5586120A (en) 1978-12-22 1978-12-22 Grinding method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15905778A JPS5586120A (en) 1978-12-22 1978-12-22 Grinding method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5586120A true JPS5586120A (en) 1980-06-28

Family

ID=15685271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15905778A Pending JPS5586120A (en) 1978-12-22 1978-12-22 Grinding method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5586120A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038486A (en) * 1983-08-11 1985-02-28 Showa Denko Kk Fine abrasive powder
JPH07235519A (en) * 1994-02-24 1995-09-05 Furukawa Electric Co Ltd:The Method for manufacturing compound semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038486A (en) * 1983-08-11 1985-02-28 Showa Denko Kk Fine abrasive powder
JPH07235519A (en) * 1994-02-24 1995-09-05 Furukawa Electric Co Ltd:The Method for manufacturing compound semiconductor wafer

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