JPS5586354U - - Google Patents
Info
- Publication number
- JPS5586354U JPS5586354U JP1978169072U JP16907278U JPS5586354U JP S5586354 U JPS5586354 U JP S5586354U JP 1978169072 U JP1978169072 U JP 1978169072U JP 16907278 U JP16907278 U JP 16907278U JP S5586354 U JPS5586354 U JP S5586354U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978169072U JPS5586354U (2) | 1978-12-11 | 1978-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978169072U JPS5586354U (2) | 1978-12-11 | 1978-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5586354U true JPS5586354U (2) | 1980-06-14 |
Family
ID=29170801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978169072U Pending JPS5586354U (2) | 1978-12-11 | 1978-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5586354U (2) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105154U (ja) * | 1982-01-11 | 1983-07-18 | 三洋電機株式会社 | 半導体装置 |
| JPS6431450A (en) * | 1987-07-28 | 1989-02-01 | Nec Corp | Ic package |
| JPH01147850A (ja) * | 1987-12-04 | 1989-06-09 | Fuji Electric Co Ltd | 多層形半導体装置 |
| JPH10107188A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 半導体装置 |
| JP2003502852A (ja) * | 1999-06-17 | 2003-01-21 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | 多層プリント回路板へチップを装着するための構成 |
| JP2006319136A (ja) * | 2005-05-12 | 2006-11-24 | Mitsubishi Electric Corp | 高周波モジュール |
-
1978
- 1978-12-11 JP JP1978169072U patent/JPS5586354U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105154U (ja) * | 1982-01-11 | 1983-07-18 | 三洋電機株式会社 | 半導体装置 |
| JPS6431450A (en) * | 1987-07-28 | 1989-02-01 | Nec Corp | Ic package |
| JPH01147850A (ja) * | 1987-12-04 | 1989-06-09 | Fuji Electric Co Ltd | 多層形半導体装置 |
| JPH10107188A (ja) * | 1996-09-27 | 1998-04-24 | Kyocera Corp | 半導体装置 |
| JP2003502852A (ja) * | 1999-06-17 | 2003-01-21 | テレフオンアクチーボラゲツト エル エム エリクソン（パブル） | 多層プリント回路板へチップを装着するための構成 |
| JP2006319136A (ja) * | 2005-05-12 | 2006-11-24 | Mitsubishi Electric Corp | 高周波モジュール |