JPS5587451A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPS5587451A JPS5587451A JP16152178A JP16152178A JPS5587451A JP S5587451 A JPS5587451 A JP S5587451A JP 16152178 A JP16152178 A JP 16152178A JP 16152178 A JP16152178 A JP 16152178A JP S5587451 A JPS5587451 A JP S5587451A
- Authority
- JP
- Japan
- Prior art keywords
- connecting part
- chip
- constitution
- pattern
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title abstract 3
- 229910052804 chromium Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To produce no positional gap between a circuit and a connecting part by a method wherein a connecting part connecting to an electronic circuit in the center part and an electric pattern having an external terminal on the outer edge of a highly dielectric substrate, are formed to be used as a probe.
CONSTITUTION: An electric pattern 3 is formed on a highly dielectric substrate 1 to be covered with an insulation layer 5 for use as a probe card. At the center part of this pattern 3, a connecting part 2 and an external terminal 4 are provided, which match with each protruded electrode 7 of an IC chip 6 to be inspected and are exposed from the insulating layer 5. They are prepared by the evaporation or photographic etching of the metals like Au, Cr, Ni and Cr. In this constitution, a connection to the electrode 7 can be done only by placing the IC chip 6 inside the connecting part 2 resulting in causing no positional gap. A plural number of different cards corresponding to the shape of the chip must be prepared.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16152178A JPS5587451A (en) | 1978-12-26 | 1978-12-26 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16152178A JPS5587451A (en) | 1978-12-26 | 1978-12-26 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5587451A true JPS5587451A (en) | 1980-07-02 |
Family
ID=15736651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16152178A Pending JPS5587451A (en) | 1978-12-26 | 1978-12-26 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5587451A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221068A (en) * | 1985-07-19 | 1987-01-29 | Koichi Yoshida | Flat-type probe |
| JPS62177454A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristic of semiconductor wafer |
| JPS62177455A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristics of semiconductor wafer |
| JPS62177456A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristic of semiconductor wafer |
| US4870356A (en) * | 1987-09-30 | 1989-09-26 | Digital Equipment Corporation | Multi-component test fixture |
| JPH05340964A (en) * | 1992-06-05 | 1993-12-24 | Mitsubishi Electric Corp | Tester for wafer and chip |
-
1978
- 1978-12-26 JP JP16152178A patent/JPS5587451A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221068A (en) * | 1985-07-19 | 1987-01-29 | Koichi Yoshida | Flat-type probe |
| JPS62177454A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristic of semiconductor wafer |
| JPS62177455A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristics of semiconductor wafer |
| JPS62177456A (en) * | 1986-01-31 | 1987-08-04 | Tanaka Kikinzoku Kogyo Kk | Probe stylus for measuring electric characteristic of semiconductor wafer |
| US4870356A (en) * | 1987-09-30 | 1989-09-26 | Digital Equipment Corporation | Multi-component test fixture |
| JPH05340964A (en) * | 1992-06-05 | 1993-12-24 | Mitsubishi Electric Corp | Tester for wafer and chip |
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