JPS558923Y2 - - Google Patents
Info
- Publication number
- JPS558923Y2 JPS558923Y2 JP1973108559U JP10855973U JPS558923Y2 JP S558923 Y2 JPS558923 Y2 JP S558923Y2 JP 1973108559 U JP1973108559 U JP 1973108559U JP 10855973 U JP10855973 U JP 10855973U JP S558923 Y2 JPS558923 Y2 JP S558923Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973108559U JPS558923Y2 (2) | 1973-09-17 | 1973-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973108559U JPS558923Y2 (2) | 1973-09-17 | 1973-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5054058U JPS5054058U (2) | 1975-05-23 |
| JPS558923Y2 true JPS558923Y2 (2) | 1980-02-27 |
Family
ID=28328415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973108559U Expired JPS558923Y2 (2) | 1973-09-17 | 1973-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS558923Y2 (2) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571047A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Lead frame for resin mold |
| WO2025009349A1 (ja) * | 2023-07-04 | 2025-01-09 | ローム株式会社 | 電子装置 |
-
1973
- 1973-09-17 JP JP1973108559U patent/JPS558923Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5054058U (2) | 1975-05-23 |