JPS5590253A - Method and device for cutting off hard brittle material by vibration - Google Patents

Method and device for cutting off hard brittle material by vibration

Info

Publication number
JPS5590253A
JPS5590253A JP16178078A JP16178078A JPS5590253A JP S5590253 A JPS5590253 A JP S5590253A JP 16178078 A JP16178078 A JP 16178078A JP 16178078 A JP16178078 A JP 16178078A JP S5590253 A JPS5590253 A JP S5590253A
Authority
JP
Japan
Prior art keywords
workpieces
cutting
rest
vibrator
hard brittle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16178078A
Other languages
Japanese (ja)
Other versions
JPS5746987B2 (en
Inventor
Kenichi Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOGAMI KOGYO KK
Muratani Machine Manufacture Co Ltd
Original Assignee
TOGAMI KOGYO KK
Muratani Machine Manufacture Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOGAMI KOGYO KK, Muratani Machine Manufacture Co Ltd filed Critical TOGAMI KOGYO KK
Priority to JP16178078A priority Critical patent/JPS5590253A/en
Publication of JPS5590253A publication Critical patent/JPS5590253A/en
Publication of JPS5746987B2 publication Critical patent/JPS5746987B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To reduce an inertial force to motion and simultaneously and easily cut off and pick up numerous hard brittle wafers, by superposing low-frequency vibration and reciprocation on the workpieces of relatively small weight. CONSTITUTION:A vibrating system comprising a parallel spring 14, a workpiece mounting rest 16 and a vibrator 18 is provided on a sliding rest 11. The sliding rest is reciprocated by a reciprocating drive means at a desired travel in the direction of the cutting edge of a flat cutter 2. At the same time, the workpiece mounting rest 16 and workpieces 5 are vibrated at low frequency in a cutting-off direction by the vibrator 18. A working liquid in which abrasive grains are suspended is continuously supplied from a nozzle 20 to the parts of the workpieces to be cut off while the cutting edge of the flat cutter 2 is thrusted under a cutting-off load upon the workpieces 5. The workpieces are thus accurately and easily cut off as an inertial force to motion remains reduced.
JP16178078A 1978-12-27 1978-12-27 Method and device for cutting off hard brittle material by vibration Granted JPS5590253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16178078A JPS5590253A (en) 1978-12-27 1978-12-27 Method and device for cutting off hard brittle material by vibration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16178078A JPS5590253A (en) 1978-12-27 1978-12-27 Method and device for cutting off hard brittle material by vibration

Publications (2)

Publication Number Publication Date
JPS5590253A true JPS5590253A (en) 1980-07-08
JPS5746987B2 JPS5746987B2 (en) 1982-10-06

Family

ID=15741756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16178078A Granted JPS5590253A (en) 1978-12-27 1978-12-27 Method and device for cutting off hard brittle material by vibration

Country Status (1)

Country Link
JP (1) JPS5590253A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817110U (en) * 1981-07-27 1983-02-02 石川　憲一 Hard and brittle material cutting and thin section cutting device using vibrating multi-blade method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174988U (en) * 1984-04-25 1985-11-20 松下電工株式会社 differential heat sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112287A (en) * 1973-02-28 1974-10-25
JPS51139773A (en) * 1975-05-28 1976-12-02 Toshiba Corp Method of cutting a semiconductor material
JPS53124392A (en) * 1976-12-27 1978-10-30 Maieru Unto Burugaa Ag Maschf Method of enhancing performance of slurry type reciprocating sawing machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112287A (en) * 1973-02-28 1974-10-25
JPS51139773A (en) * 1975-05-28 1976-12-02 Toshiba Corp Method of cutting a semiconductor material
JPS53124392A (en) * 1976-12-27 1978-10-30 Maieru Unto Burugaa Ag Maschf Method of enhancing performance of slurry type reciprocating sawing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817110U (en) * 1981-07-27 1983-02-02 石川　憲一 Hard and brittle material cutting and thin section cutting device using vibrating multi-blade method

Also Published As

Publication number Publication date
JPS5746987B2 (en) 1982-10-06

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