JPS5591642A - Holding device for inserted body at enclosing molder - Google Patents
Holding device for inserted body at enclosing molderInfo
- Publication number
- JPS5591642A JPS5591642A JP16595678A JP16595678A JPS5591642A JP S5591642 A JPS5591642 A JP S5591642A JP 16595678 A JP16595678 A JP 16595678A JP 16595678 A JP16595678 A JP 16595678A JP S5591642 A JPS5591642 A JP S5591642A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pin
- insert
- cavity
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 abstract 7
- 229920005989 resin Polymers 0.000 abstract 7
- 238000000465 moulding Methods 0.000 abstract 4
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To facilitate a making of completely closed insert molding means by retracting a holding pin in response to an injection of molding resin into a cavity via gate.
CONSTITUTION: Insert holding device is constituted by holder pins 2, 2 for holding insert 1, a cylinder 22 projecting into a cavity 3 formed between the upper and lower mold plates, and a stop pin 23 of a holding pin. Molding resin A is injected into a cavity 3 at an outer circumference of the insert 1, the resin A is introduced into an enclosing cavity 6 enclosed by a leading end surface of the pin 2 and an inner circumferential surface of the insert 1 from a secondary gate 5 at the leading end of the pin 2 filled in the cavity 6. A molding pressure of the and resin A is applied to the end surfaces of the pins 2, 2, and the pins 2, 2 are retracted by this pressure. When an injection of the resin A is completed, the injected condition is kept until a curing of the resin A is finished. Upon completion of the curing of the resin, the molded parts or molds are opened, the pin 2 is further retracted and the finished product is pushed out by the pin 21.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16595678A JPS5591642A (en) | 1978-12-29 | 1978-12-29 | Holding device for inserted body at enclosing molder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16595678A JPS5591642A (en) | 1978-12-29 | 1978-12-29 | Holding device for inserted body at enclosing molder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5591642A true JPS5591642A (en) | 1980-07-11 |
| JPS577058B2 JPS577058B2 (en) | 1982-02-08 |
Family
ID=15822204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16595678A Granted JPS5591642A (en) | 1978-12-29 | 1978-12-29 | Holding device for inserted body at enclosing molder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5591642A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787909A (en) * | 1980-11-21 | 1982-06-01 | Hida Denki Kk | Method for inserting core member in synthetic resin material and molding in one body |
| JPS5818223A (en) * | 1981-07-28 | 1983-02-02 | Omron Tateisi Electronics Co | Molding method |
| JPS59209112A (en) * | 1983-05-13 | 1984-11-27 | Omron Tateisi Electronics Co | Molding die |
| US6063321A (en) * | 1995-05-19 | 2000-05-16 | Denso Corp. | Method for forming a casting which includes an insert |
| US6428732B1 (en) | 1998-06-09 | 2002-08-06 | Denso Corporation | Insert-molding method for obtaining a resin-molded product |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51127955U (en) * | 1975-04-09 | 1976-10-16 |
-
1978
- 1978-12-29 JP JP16595678A patent/JPS5591642A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51127955U (en) * | 1975-04-09 | 1976-10-16 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787909A (en) * | 1980-11-21 | 1982-06-01 | Hida Denki Kk | Method for inserting core member in synthetic resin material and molding in one body |
| JPS5818223A (en) * | 1981-07-28 | 1983-02-02 | Omron Tateisi Electronics Co | Molding method |
| JPS59209112A (en) * | 1983-05-13 | 1984-11-27 | Omron Tateisi Electronics Co | Molding die |
| US6063321A (en) * | 1995-05-19 | 2000-05-16 | Denso Corp. | Method for forming a casting which includes an insert |
| US6309579B1 (en) | 1995-05-19 | 2001-10-30 | Nippondenso Co., Ltd. | Method for forming a casting which includes an insert |
| US6923632B2 (en) | 1995-05-19 | 2005-08-02 | Denso Corporation | Method and apparatus for forming a casting which includes an insert |
| DE19620002B4 (en) * | 1995-05-19 | 2010-07-29 | DENSO CORPORATION, Kariya-shi | A method of forming an injection molded part containing an insert |
| US6428732B1 (en) | 1998-06-09 | 2002-08-06 | Denso Corporation | Insert-molding method for obtaining a resin-molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS577058B2 (en) | 1982-02-08 |
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