JPS5594473A - Ion plating apparatus for multi-component coating - Google Patents
Ion plating apparatus for multi-component coatingInfo
- Publication number
- JPS5594473A JPS5594473A JP192679A JP192679A JPS5594473A JP S5594473 A JPS5594473 A JP S5594473A JP 192679 A JP192679 A JP 192679A JP 192679 A JP192679 A JP 192679A JP S5594473 A JPS5594473 A JP S5594473A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- composing
- component coating
- component ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 238000007733 ion plating Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 230000008020 evaporation Effects 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To make the control of component ratio easy and to form the multi-component coating, by providing one or two or more of sputtering electrode near the substrate and composing so as to be co-deposited the substrate composing the above electrode with the substance from evaporation source on the surface of the substrate at the same time. CONSTITUTION:Apparatus is constructed by arranging the evaporation source 2 and the substrate 5 facing each other in the vacuum room 1 provided gas exhausting system (not shown in the figure) and gas introducing system and newly providing the sputtering electrode 6 near the substrate 5 with an usual construction arranged the thermal cathode 3 and the anode 4 is order to form discharge plasma. It is constructed so as to be applied a hogh negative voltage on the electrode 6 in the room 1. By the above apparatus, the substance from the source 2 and that of composing the electrode 6, are co-deposited on the substrate 5 and also, the component ratio is able to control easily. Multi-component coating having disired component ratio, is able to form easily with a cheap apparatus compared with usual method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP192679A JPS5594473A (en) | 1979-01-11 | 1979-01-11 | Ion plating apparatus for multi-component coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP192679A JPS5594473A (en) | 1979-01-11 | 1979-01-11 | Ion plating apparatus for multi-component coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5594473A true JPS5594473A (en) | 1980-07-17 |
Family
ID=11515195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP192679A Pending JPS5594473A (en) | 1979-01-11 | 1979-01-11 | Ion plating apparatus for multi-component coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5594473A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6083365A (en) * | 1997-10-21 | 2000-07-04 | Sanyo Vacuum Industries Co. Ltd. | Method for forming a thin film and apparatus for the same |
| US8691064B2 (en) * | 2007-07-09 | 2014-04-08 | Raytheon Canada Limited | Sputter-enhanced evaporative deposition apparatus and method |
-
1979
- 1979-01-11 JP JP192679A patent/JPS5594473A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6083365A (en) * | 1997-10-21 | 2000-07-04 | Sanyo Vacuum Industries Co. Ltd. | Method for forming a thin film and apparatus for the same |
| US6090457A (en) * | 1997-10-21 | 2000-07-18 | Sanyo Vaccum Industries Co. Ltd. | Process of making a thin film |
| US8691064B2 (en) * | 2007-07-09 | 2014-04-08 | Raytheon Canada Limited | Sputter-enhanced evaporative deposition apparatus and method |
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