JPS56110868U - - Google Patents
Info
- Publication number
- JPS56110868U JPS56110868U JP1980007292U JP729280U JPS56110868U JP S56110868 U JPS56110868 U JP S56110868U JP 1980007292 U JP1980007292 U JP 1980007292U JP 729280 U JP729280 U JP 729280U JP S56110868 U JPS56110868 U JP S56110868U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980007292U JPS56110868U (2) | 1980-01-24 | 1980-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980007292U JPS56110868U (2) | 1980-01-24 | 1980-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56110868U true JPS56110868U (2) | 1981-08-27 |
Family
ID=29603950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980007292U Pending JPS56110868U (2) | 1980-01-24 | 1980-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56110868U (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618998A (ja) * | 1984-06-22 | 1986-01-16 | 松下電器産業株式会社 | 接着剤塗布方法 |
| JP2017511609A (ja) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |
-
1980
- 1980-01-24 JP JP1980007292U patent/JPS56110868U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618998A (ja) * | 1984-06-22 | 1986-01-16 | 松下電器産業株式会社 | 接着剤塗布方法 |
| JP2017511609A (ja) * | 2014-04-18 | 2017-04-20 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |
| JP2019041129A (ja) * | 2014-04-18 | 2019-03-14 | レイセオン カンパニー | 熱的改善のために表面実装パッケージをアライメントする方法 |