JPS56122169A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56122169A JPS56122169A JP2584280A JP2584280A JPS56122169A JP S56122169 A JPS56122169 A JP S56122169A JP 2584280 A JP2584280 A JP 2584280A JP 2584280 A JP2584280 A JP 2584280A JP S56122169 A JPS56122169 A JP S56122169A
- Authority
- JP
- Japan
- Prior art keywords
- type
- ccd
- photoresist
- mask
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/335—Channel regions of field-effect devices of charge-coupled devices
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
PURPOSE:To simplify the steps of manufacturing a semiconductor device by forming a mask with photoresist on a semiconductor substrate to be formed with a surface channel CCD to form a buried channel CCD, then removing the mask and forming a surface channel CCD. CONSTITUTION:The first oxide film 2 is covered on the upper surface of a silicon semiconductor substrate 1. A photoresist 3 is formed with a mask on the upper surface of a surface channel (SC) type CCD forming region X, phosphorus ion (P<+>) is injected to form an N<+> type impuritydoped layer 5 on the region not masked, and a buried channel (BC) type CCD is formed. Thereafter, the photoresist 3 is removed, the first insulating electrode 6, the second insulating electrode 11 and oxide films 9, 12 are formed on the upper surface of the oxide film 2, and P<+> type layer 8 and N<-> type layer 8' becoming charge guide regions are formed on the surface of the substrate 1. Thus, two phase CCD of the SC type BC type are simultaneously formed on the same substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2584280A JPS56122169A (en) | 1980-02-29 | 1980-02-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2584280A JPS56122169A (en) | 1980-02-29 | 1980-02-29 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56122169A true JPS56122169A (en) | 1981-09-25 |
Family
ID=12177096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2584280A Pending JPS56122169A (en) | 1980-02-29 | 1980-02-29 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56122169A (en) |
-
1980
- 1980-02-29 JP JP2584280A patent/JPS56122169A/en active Pending
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