JPS56141349A - Curable polyphenylene ether type resin composition - Google Patents

Curable polyphenylene ether type resin composition

Info

Publication number
JPS56141349A
JPS56141349A JP4442880A JP4442880A JPS56141349A JP S56141349 A JPS56141349 A JP S56141349A JP 4442880 A JP4442880 A JP 4442880A JP 4442880 A JP4442880 A JP 4442880A JP S56141349 A JPS56141349 A JP S56141349A
Authority
JP
Japan
Prior art keywords
polyphenylene ether
resin
polyfunctional
blended
lower alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4442880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6118937B2 (2
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP4442880A priority Critical patent/JPS56141349A/ja
Priority to US06/246,314 priority patent/US4389516A/en
Priority to DE3111403A priority patent/DE3111403C2/de
Publication of JPS56141349A publication Critical patent/JPS56141349A/ja
Publication of JPS6118937B2 publication Critical patent/JPS6118937B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP4442880A 1980-03-24 1980-04-03 Curable polyphenylene ether type resin composition Granted JPS56141349A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4442880A JPS56141349A (en) 1980-04-03 1980-04-03 Curable polyphenylene ether type resin composition
US06/246,314 US4389516A (en) 1980-03-24 1981-03-23 Curable polyphenylene ether resin composition
DE3111403A DE3111403C2 (de) 1980-03-24 1981-03-23 Härtbare Polyphenylenätherharzmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4442880A JPS56141349A (en) 1980-04-03 1980-04-03 Curable polyphenylene ether type resin composition

Publications (2)

Publication Number Publication Date
JPS56141349A true JPS56141349A (en) 1981-11-05
JPS6118937B2 JPS6118937B2 (2) 1986-05-15

Family

ID=12691213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4442880A Granted JPS56141349A (en) 1980-03-24 1980-04-03 Curable polyphenylene ether type resin composition

Country Status (1)

Country Link
JP (1) JPS56141349A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
CN1305962C (zh) * 2003-01-17 2007-03-21 三菱瓦斯化学株式会社 可固化树脂组合物及其固化产品
US8277948B2 (en) 2006-02-17 2012-10-02 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003128909A (ja) * 2001-10-23 2003-05-08 Asahi Kasei Corp 難燃性熱硬化樹脂組成物
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
WO2015152427A1 (ja) 2014-04-04 2015-10-08 日立化成株式会社 Ｎ－置換マレイミド基を有するポリフェニレンエーテル誘導体、並びにそれを用いた熱硬化性樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及び多層プリント配線板
US11339251B2 (en) 2016-07-05 2022-05-24 Showa Denko Materials Co., Ltd. Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
WO2018016489A1 (ja) 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板
KR102478957B1 (ko) 2016-07-20 2022-12-16 쇼와덴코머티리얼즈가부시끼가이샤 수지 조성물, 수지층 부착 지지체, 프리프레그, 적층판, 다층 프린트 배선판 및 밀리미터파 레이더용 프린트 배선판
CN108401433B (zh) 2016-12-07 2019-05-28 日立化成株式会社 树脂清漆、预浸渍体、层叠板及印制线路板
MY181060A (en) 2016-12-07 2020-12-16 Showa Denko Materials Co Ltd Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
CN1305962C (zh) * 2003-01-17 2007-03-21 三菱瓦斯化学株式会社 可固化树脂组合物及其固化产品
US8277948B2 (en) 2006-02-17 2012-10-02 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
US8501870B2 (en) 2006-02-17 2013-08-06 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
US8568891B2 (en) 2006-02-17 2013-10-29 Hitachi Chemical Company, Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
EP2407503B1 (en) * 2006-02-17 2020-01-08 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same

Also Published As

Publication number Publication date
JPS6118937B2 (2) 1986-05-15

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