JPS56142015A - Molding polyamide-imide resin - Google Patents
Molding polyamide-imide resinInfo
- Publication number
- JPS56142015A JPS56142015A JP4639080A JP4639080A JPS56142015A JP S56142015 A JPS56142015 A JP S56142015A JP 4639080 A JP4639080 A JP 4639080A JP 4639080 A JP4639080 A JP 4639080A JP S56142015 A JPS56142015 A JP S56142015A
- Authority
- JP
- Japan
- Prior art keywords
- imide resin
- polyamide
- resin
- mold
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 title abstract 5
- 238000000465 moulding Methods 0.000 title abstract 4
- 239000004962 Polyamide-imide Substances 0.000 title abstract 3
- 229920002312 polyamide-imide Polymers 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000003578 releasing effect Effects 0.000 abstract 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE: To reduce the time of staying of a resin in a molding machine, enhance the mold releasing property of a molded article and obtain a molded article having excellent toughness and surface properties by melt molding the polyamide-imide resin using a mold prepared from specified material.
CONSTITUTION: When melting by heating the polyamide-imide resin, for instance, one represented by the formula (wherein Ar is an aromatic ring), copper or an alloy thereof (preferably, an alloy containing 5W10wt% of Sn and 2W5wt% of Zn) is used as a material for a molding part or the mold which is contacted with the molten resin.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4639080A JPS56142015A (en) | 1980-04-09 | 1980-04-09 | Molding polyamide-imide resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4639080A JPS56142015A (en) | 1980-04-09 | 1980-04-09 | Molding polyamide-imide resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56142015A true JPS56142015A (en) | 1981-11-06 |
Family
ID=12745813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4639080A Pending JPS56142015A (en) | 1980-04-09 | 1980-04-09 | Molding polyamide-imide resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56142015A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5244605A (en) * | 1990-06-13 | 1993-09-14 | Mitsubishi Gas Chemical Co., Inc. | Process for producing halogenated polycarbonate molded article |
-
1980
- 1980-04-09 JP JP4639080A patent/JPS56142015A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5244605A (en) * | 1990-06-13 | 1993-09-14 | Mitsubishi Gas Chemical Co., Inc. | Process for producing halogenated polycarbonate molded article |
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