JPS56142631A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56142631A JPS56142631A JP4646480A JP4646480A JPS56142631A JP S56142631 A JPS56142631 A JP S56142631A JP 4646480 A JP4646480 A JP 4646480A JP 4646480 A JP4646480 A JP 4646480A JP S56142631 A JPS56142631 A JP S56142631A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- opening
- polycrystal
- section
- lasers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
Landscapes
- Recrystallisation Techniques (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To eliminate the need for occupying area for forming a contacting section by a method wherein a semiconductor layer made up on a semiconductor substrate through an insulating film with an opening is annealed by lasers or electron beams, the semiconductor layer of the opening section is changed into a single crystal and an element is manufactured. CONSTITUTION:An insulating film 2 with an opening is made up on a semiconductor substrate 1, the film 2 is coated with a polycrystal or amorphous Si, an Si layer of the opening section is changed into a single crystal by annealing by lasers or electron beams, B, etc. are diffused and a base region 7 and a P type polycrystal Si layer 6 are built up, P, etc. are introduced and an N type emitter region 10 is formed, the polycrystal Si layer 6 is used as a wiring conductor as it is, and wiring bodies 11, 11' are made up. Thus, occupying area for forming a contacting section of an electrode and positioning allowance are not required, and high density is obtd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4646480A JPS56142631A (en) | 1980-04-09 | 1980-04-09 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4646480A JPS56142631A (en) | 1980-04-09 | 1980-04-09 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56142631A true JPS56142631A (en) | 1981-11-07 |
Family
ID=12747883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4646480A Pending JPS56142631A (en) | 1980-04-09 | 1980-04-09 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56142631A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4523962A (en) * | 1982-12-13 | 1985-06-18 | Mitsubishi Denki Kabushiki Kaisha | Method for fabricating monocrystalline semiconductor layer on insulating layer by laser crystallization using a grid of anti-reflection coating disposed on poly/amorphous semiconductor |
| US4609407A (en) * | 1979-11-21 | 1986-09-02 | Hitachi, Ltd. | Method of making three dimensional semiconductor devices in selectively laser regrown polysilicon or amorphous silicon layers |
-
1980
- 1980-04-09 JP JP4646480A patent/JPS56142631A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4609407A (en) * | 1979-11-21 | 1986-09-02 | Hitachi, Ltd. | Method of making three dimensional semiconductor devices in selectively laser regrown polysilicon or amorphous silicon layers |
| US4523962A (en) * | 1982-12-13 | 1985-06-18 | Mitsubishi Denki Kabushiki Kaisha | Method for fabricating monocrystalline semiconductor layer on insulating layer by laser crystallization using a grid of anti-reflection coating disposed on poly/amorphous semiconductor |
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