JPS56155802A - Recognition device - Google Patents
Recognition deviceInfo
- Publication number
- JPS56155802A JPS56155802A JP5964280A JP5964280A JPS56155802A JP S56155802 A JPS56155802 A JP S56155802A JP 5964280 A JP5964280 A JP 5964280A JP 5964280 A JP5964280 A JP 5964280A JP S56155802 A JPS56155802 A JP S56155802A
- Authority
- JP
- Japan
- Prior art keywords
- light source
- light
- image
- detect
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Input (AREA)
Abstract
PURPOSE:To detect a light image at a high SN ratio by alternating a reflected light source and transmitted light source which illuminate a pattern on a ceramic substrate of hybrid IC. CONSTITUTION:To detect the light image of wiring pattern 4 on IC chip 3 of hybrid IC, illumination light source change-over circuit 19 opens shutter 12 and light from reflected light source 11 is projected on IC chip 3 through half-mirror 15. The reflected light image is detected by image pickup element 16 and binary-coded by preprocessing circuit 17, and pattern detecting circuit 18 detects its position. To detect the light image of wiring pattern 2 on a ceramic substrate, illumination light source change-over circuit 19 opens shutter 14 to irradiate substrate 1 with light from transmitted light source 13. Thus, the light images are detected at high SN ratios and detection are reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5964280A JPS56155802A (en) | 1980-05-06 | 1980-05-06 | Recognition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5964280A JPS56155802A (en) | 1980-05-06 | 1980-05-06 | Recognition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56155802A true JPS56155802A (en) | 1981-12-02 |
Family
ID=13119070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5964280A Pending JPS56155802A (en) | 1980-05-06 | 1980-05-06 | Recognition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56155802A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59102106A (en) * | 1982-12-03 | 1984-06-13 | Hitachi Denshi Syst Service Kk | Inspection method |
| JPS6055480A (en) * | 1983-09-07 | 1985-03-30 | Oki Electric Ind Co Ltd | Pattern position recognizing method |
| JPS62138987A (en) * | 1985-12-12 | 1987-06-22 | Nec Corp | Pattern recognizing method for through hole image |
| JPS63186376A (en) * | 1987-01-28 | 1988-08-01 | Ckd Corp | Checking method for taped parts |
| JPH02187635A (en) * | 1989-01-17 | 1990-07-23 | Audio Technica Corp | Color discriminating device |
| JPH04315036A (en) * | 1991-04-12 | 1992-11-06 | Mitsubishi Electric Corp | Apparatus for inspecting transparent mold ic |
| JPH0587546A (en) * | 1990-04-28 | 1993-04-06 | Seiwa Sangyo Kk | Method and device for inspecting appearance |
| US5225891A (en) * | 1990-10-09 | 1993-07-06 | Kabushiki Kaisha Toshiba | Wire bonding external appearance inspecting apparatus |
| JPH08274136A (en) * | 1995-03-31 | 1996-10-18 | Ishikawa Pref Gov | Hybrid IC inspection device |
| JP2009014744A (en) * | 2008-10-20 | 2009-01-22 | Toshiba Corp | Pattern defect inspection system |
| US7522276B2 (en) | 2003-03-31 | 2009-04-21 | Kabushiki Kaisha Toshiba | Pattern inspection method |
-
1980
- 1980-05-06 JP JP5964280A patent/JPS56155802A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59102106A (en) * | 1982-12-03 | 1984-06-13 | Hitachi Denshi Syst Service Kk | Inspection method |
| JPS6055480A (en) * | 1983-09-07 | 1985-03-30 | Oki Electric Ind Co Ltd | Pattern position recognizing method |
| JPS62138987A (en) * | 1985-12-12 | 1987-06-22 | Nec Corp | Pattern recognizing method for through hole image |
| JPS63186376A (en) * | 1987-01-28 | 1988-08-01 | Ckd Corp | Checking method for taped parts |
| JPH02187635A (en) * | 1989-01-17 | 1990-07-23 | Audio Technica Corp | Color discriminating device |
| JPH0587546A (en) * | 1990-04-28 | 1993-04-06 | Seiwa Sangyo Kk | Method and device for inspecting appearance |
| US5225891A (en) * | 1990-10-09 | 1993-07-06 | Kabushiki Kaisha Toshiba | Wire bonding external appearance inspecting apparatus |
| JPH04315036A (en) * | 1991-04-12 | 1992-11-06 | Mitsubishi Electric Corp | Apparatus for inspecting transparent mold ic |
| JPH08274136A (en) * | 1995-03-31 | 1996-10-18 | Ishikawa Pref Gov | Hybrid IC inspection device |
| US7522276B2 (en) | 2003-03-31 | 2009-04-21 | Kabushiki Kaisha Toshiba | Pattern inspection method |
| JP2009014744A (en) * | 2008-10-20 | 2009-01-22 | Toshiba Corp | Pattern defect inspection system |
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