JPS56156A - Copper lined phenol resin laminated board - Google Patents
Copper lined phenol resin laminated boardInfo
- Publication number
- JPS56156A JPS56156A JP7617479A JP7617479A JPS56156A JP S56156 A JPS56156 A JP S56156A JP 7617479 A JP7617479 A JP 7617479A JP 7617479 A JP7617479 A JP 7617479A JP S56156 A JPS56156 A JP S56156A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- laminated board
- resin laminated
- copper lined
- lined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 239000005011 phenolic resin Substances 0.000 title 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7617479A JPS6054860B2 (en) | 1979-06-15 | 1979-06-15 | Copper-clad phenolic resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7617479A JPS6054860B2 (en) | 1979-06-15 | 1979-06-15 | Copper-clad phenolic resin laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56156A true JPS56156A (en) | 1981-01-06 |
| JPS6054860B2 JPS6054860B2 (en) | 1985-12-02 |
Family
ID=13597723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7617479A Expired JPS6054860B2 (en) | 1979-06-15 | 1979-06-15 | Copper-clad phenolic resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054860B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124938A (en) * | 1985-11-25 | 1987-06-06 | 新神戸電機株式会社 | Manufacture of metallic-foil lined laminated board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278886B (en) | 2017-11-16 | 2023-02-17 | 三菱化学株式会社 | Thermosetting resin composition, prepreg, fiber-reinforced composite material, and method for producing same |
-
1979
- 1979-06-15 JP JP7617479A patent/JPS6054860B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124938A (en) * | 1985-11-25 | 1987-06-06 | 新神戸電機株式会社 | Manufacture of metallic-foil lined laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6054860B2 (en) | 1985-12-02 |
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