JPS5616552A - Synthetic resin composition having improved thermal cycling - Google Patents
Synthetic resin composition having improved thermal cyclingInfo
- Publication number
- JPS5616552A JPS5616552A JP9107279A JP9107279A JPS5616552A JP S5616552 A JPS5616552 A JP S5616552A JP 9107279 A JP9107279 A JP 9107279A JP 9107279 A JP9107279 A JP 9107279A JP S5616552 A JPS5616552 A JP S5616552A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- synthetic resin
- thermal cycling
- improved thermal
- silicon compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 229920003002 synthetic resin Polymers 0.000 title 1
- 239000000057 synthetic resin Substances 0.000 title 1
- 238000005382 thermal cycling Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 229920002492 poly(sulfone) Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 150000003377 silicon compounds Chemical class 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- -1 polysiloxane Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The titled composition not required to make the thickness of deposition large, capable of forming an improved plating product through nickel plating requiring no copper deposition, obtained by adding an organic silicon compound to a blend of a polysulfone and an ABC resins.
CONSTITUTION: 100pts.wt. blend consisting of 100W5wt% polysulfone resin and 0W95wt% ABS resin is blended with 0.05W3.0pts.wt. organic silicon compound, for example, a polysiloxane shown by the formula (R1WR4 are lower alkyl or aryl; n is 1W3) having a viscosity of preferably 101W105CPS.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9107279A JPS6032658B2 (en) | 1979-07-18 | 1979-07-18 | Synthetic resin composition with excellent heat cycle properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9107279A JPS6032658B2 (en) | 1979-07-18 | 1979-07-18 | Synthetic resin composition with excellent heat cycle properties |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5616552A true JPS5616552A (en) | 1981-02-17 |
| JPS6032658B2 JPS6032658B2 (en) | 1985-07-29 |
Family
ID=14016291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9107279A Expired JPS6032658B2 (en) | 1979-07-18 | 1979-07-18 | Synthetic resin composition with excellent heat cycle properties |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032658B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125736A (en) * | 1982-01-20 | 1983-07-26 | Sanyo Kako Kk | Delustered thermoplastic resin composition |
| EP2500381A1 (en) * | 2011-03-16 | 2012-09-19 | Siemens Medical Instruments Pte. Ltd. | Hydrophobic ABS plastic material for housing |
| US10497823B2 (en) | 2018-03-14 | 2019-12-03 | Kabushiki Kaisha Toshiba | Light receiving device and method of manufacturing light receiving device |
-
1979
- 1979-07-18 JP JP9107279A patent/JPS6032658B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58125736A (en) * | 1982-01-20 | 1983-07-26 | Sanyo Kako Kk | Delustered thermoplastic resin composition |
| EP2500381A1 (en) * | 2011-03-16 | 2012-09-19 | Siemens Medical Instruments Pte. Ltd. | Hydrophobic ABS plastic material for housing |
| US8611568B2 (en) | 2011-03-16 | 2013-12-17 | Siemens Medical Instruments Pte. Ltd. | Hydrophobic ABS plastics material for casings |
| US10497823B2 (en) | 2018-03-14 | 2019-12-03 | Kabushiki Kaisha Toshiba | Light receiving device and method of manufacturing light receiving device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6032658B2 (en) | 1985-07-29 |
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