JPS5616672A - Sputtering target - Google Patents

Sputtering target

Info

Publication number
JPS5616672A
JPS5616672A JP9143079A JP9143079A JPS5616672A JP S5616672 A JPS5616672 A JP S5616672A JP 9143079 A JP9143079 A JP 9143079A JP 9143079 A JP9143079 A JP 9143079A JP S5616672 A JPS5616672 A JP S5616672A
Authority
JP
Japan
Prior art keywords
recess
sputtering
target
film forming
forming speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9143079A
Other languages
Japanese (ja)
Other versions
JPS5931592B2 (en
Inventor
Takeshi Itabane
Akio Nishiyama
Shotaro Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP9143079A priority Critical patent/JPS5931592B2/en
Publication of JPS5616672A publication Critical patent/JPS5616672A/en
Publication of JPS5931592B2 publication Critical patent/JPS5931592B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To enhance the sputtering efficiency and increase the film forming speed by specifying the area ratio of the total of faces on which ion is hit inside the recess of a target to the inside of the recess. CONSTITUTION:The normals of recess 2 of target 1 are formed so that arbitrary faces on which sputtered ion 3 is hit inside the same recess amounts to 50-96% of the total area of the inside of recess 3. Thus, the sputtering efficiency is enhanced and the film forming speed is increased without deteriorating the film quality. In addition, sputtering in a high vacuum is enabled.
JP9143079A 1979-07-18 1979-07-18 Target for sputtering Expired JPS5931592B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9143079A JPS5931592B2 (en) 1979-07-18 1979-07-18 Target for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9143079A JPS5931592B2 (en) 1979-07-18 1979-07-18 Target for sputtering

Publications (2)

Publication Number Publication Date
JPS5616672A true JPS5616672A (en) 1981-02-17
JPS5931592B2 JPS5931592B2 (en) 1984-08-02

Family

ID=14026147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9143079A Expired JPS5931592B2 (en) 1979-07-18 1979-07-18 Target for sputtering

Country Status (1)

Country Link
JP (1) JPS5931592B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0360493U (en) * 1990-09-20 1991-06-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment

Also Published As

Publication number Publication date
JPS5931592B2 (en) 1984-08-02

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