JPS56169342A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS56169342A
JPS56169342A JP7362280A JP7362280A JPS56169342A JP S56169342 A JPS56169342 A JP S56169342A JP 7362280 A JP7362280 A JP 7362280A JP 7362280 A JP7362280 A JP 7362280A JP S56169342 A JPS56169342 A JP S56169342A
Authority
JP
Japan
Prior art keywords
purity
bonding wire
semiconductor element
bonding property
obstruct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7362280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243541B2 (de
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP7362280A priority Critical patent/JPS56169342A/ja
Publication of JPS56169342A publication Critical patent/JPS56169342A/ja
Publication of JPS6243541B2 publication Critical patent/JPS6243541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP7362280A 1980-05-31 1980-05-31 Bonding wire for semiconductor element Granted JPS56169342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7362280A JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7362280A JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS56169342A true JPS56169342A (en) 1981-12-26
JPS6243541B2 JPS6243541B2 (de) 1987-09-14

Family

ID=13523596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7362280A Granted JPS56169342A (en) 1980-05-31 1980-05-31 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS56169342A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201454A (ja) * 1983-04-28 1984-11-15 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424265A (en) * 1977-07-27 1979-02-23 Shii Bii Esu Yuugen Method of forming prefabbreinforcinggiron cage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424265A (en) * 1977-07-27 1979-02-23 Shii Bii Esu Yuugen Method of forming prefabbreinforcinggiron cage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201454A (ja) * 1983-04-28 1984-11-15 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Also Published As

Publication number Publication date
JPS6243541B2 (de) 1987-09-14

Similar Documents

Publication Publication Date Title
JPS572851A (en) Copper alloy for lead material of semiconductor device
KR880003021A (ko) 전자기기용 구리합금 및 그 제조방법
JPS56169341A (en) Bonding wire for semiconductor element
KR890016193A (ko) 반도체 장치용 Cu합금제 리이드프레임재
JPS56169342A (en) Bonding wire for semiconductor element
JPS6455351A (en) High strength zinc alloy having high castability
MY118738A (en) Wear resistance synchronizer-ring made of copper alloy
JPS56102536A (en) Composite electrical contact material
JPS57108235A (en) Copper alloy for lead frame
JPS56169340A (en) Bonding wire for semiconductor element
JPS644445A (en) Copper alloy for terminal-connector
JPS57181340A (en) Electrical contact material of selectively and internally oxidized silver-tin alloy containing bismuth
JPS5743948A (en) Platinum alloy for ornamental product
JPS5743946A (en) Platinum alloy for ornamental product
JPS5770099A (en) Gold brazing filler metal
JPS54103764A (en) Brazing material
JPS5676556A (en) Bonding gold wire for semiconductor element
JPS56123338A (en) Electrical contact material
JPS56123346A (en) Aluminum alloy for extrusion with superior hardenability
JPS648237A (en) Copper alloy for terminal and connector
JPS5688328A (en) Gold wire for bonding semiconductor element and semiconductor element
ES8501276A1 (es) Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos.
JPS5773146A (en) Wear resistant aluminum bronze alloy
JPS64240A (en) High tensile high electroconductive copper alloy
JPS5767142A (en) Low-temperature aluminum solder