JPS5619629A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS5619629A
JPS5619629A JP9474379A JP9474379A JPS5619629A JP S5619629 A JPS5619629 A JP S5619629A JP 9474379 A JP9474379 A JP 9474379A JP 9474379 A JP9474379 A JP 9474379A JP S5619629 A JPS5619629 A JP S5619629A
Authority
JP
Japan
Prior art keywords
strength
bonding wire
bonded
content
increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9474379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222451B2 (2
Inventor
Yukihiko Fukami
Shozo Hayashi
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK, Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP9474379A priority Critical patent/JPS5619629A/ja
Publication of JPS5619629A publication Critical patent/JPS5619629A/ja
Publication of JPS6222451B2 publication Critical patent/JPS6222451B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP9474379A 1979-07-25 1979-07-25 Bonding wire for semiconductor element Granted JPS5619629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9474379A JPS5619629A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9474379A JPS5619629A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5619629A true JPS5619629A (en) 1981-02-24
JPS6222451B2 JPS6222451B2 (2) 1987-05-18

Family

ID=14118597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9474379A Granted JPS5619629A (en) 1979-07-25 1979-07-25 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5619629A (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US5023144A (en) * 1989-03-24 1991-06-11 Mitsubishi Metal Corporation Silver alloy foil for interconnector for solar cell
US6139652A (en) * 1997-01-23 2000-10-31 Stern-Leach Tarnish-resistant hardenable fine silver alloys
JP2007142271A (ja) * 2005-11-21 2007-06-07 Tanaka Electronics Ind Co Ltd バンプ材料および接合構造

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885135A (en) * 1981-12-04 1989-12-05 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semi-conductor device
US5071619A (en) * 1981-12-04 1991-12-10 Mitsubishi Kinzoku Kabushiki Kaisha Fine gold alloy wire for bonding of a semiconductor device
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
US5023144A (en) * 1989-03-24 1991-06-11 Mitsubishi Metal Corporation Silver alloy foil for interconnector for solar cell
US6139652A (en) * 1997-01-23 2000-10-31 Stern-Leach Tarnish-resistant hardenable fine silver alloys
JP2007142271A (ja) * 2005-11-21 2007-06-07 Tanaka Electronics Ind Co Ltd バンプ材料および接合構造

Also Published As

Publication number Publication date
JPS6222451B2 (2) 1987-05-18

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