JPS5623898Y2 - - Google Patents
Info
- Publication number
- JPS5623898Y2 JPS5623898Y2 JP1974072102U JP7210274U JPS5623898Y2 JP S5623898 Y2 JPS5623898 Y2 JP S5623898Y2 JP 1974072102 U JP1974072102 U JP 1974072102U JP 7210274 U JP7210274 U JP 7210274U JP S5623898 Y2 JPS5623898 Y2 JP S5623898Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974072102U JPS5623898Y2 (2) | 1974-06-20 | 1974-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974072102U JPS5623898Y2 (2) | 1974-06-20 | 1974-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51868U JPS51868U (2) | 1976-01-06 |
| JPS5623898Y2 true JPS5623898Y2 (2) | 1981-06-04 |
Family
ID=28242362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974072102U Expired JPS5623898Y2 (2) | 1974-06-20 | 1974-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5623898Y2 (2) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354500A (en) * | 1976-10-27 | 1978-05-17 | Gutsudowan Kk | Traffic alarm system |
| JPS54141983A (en) * | 1978-04-25 | 1979-11-05 | Onishi Hitoshi | System for transmitting traffic information into vehicles |
| JPS58187899U (ja) * | 1982-06-09 | 1983-12-13 | 杉山 信二 | 路面用補助信号機 |
| JP2519806B2 (ja) * | 1989-09-12 | 1996-07-31 | 株式会社東芝 | 樹脂封止型半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551926Y2 (2) * | 1975-09-11 | 1980-12-03 |
-
1974
- 1974-06-20 JP JP1974072102U patent/JPS5623898Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51868U (2) | 1976-01-06 |