JPS5626452A - Semiconductor case - Google Patents

Semiconductor case

Info

Publication number
JPS5626452A
JPS5626452A JP10172379A JP10172379A JPS5626452A JP S5626452 A JPS5626452 A JP S5626452A JP 10172379 A JP10172379 A JP 10172379A JP 10172379 A JP10172379 A JP 10172379A JP S5626452 A JPS5626452 A JP S5626452A
Authority
JP
Japan
Prior art keywords
stem
semiconductor case
unnecessary
constitution
costs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10172379A
Other languages
Japanese (ja)
Inventor
Yukito Ikeda
Hidekazu Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10172379A priority Critical patent/JPS5626452A/en
Publication of JPS5626452A publication Critical patent/JPS5626452A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To improve mass productivity by forming a cap and a a stem by plastic deformation from a material. CONSTITUTION:The side of a cylindrical product 5 with a metallic bottom such as steel or the like is compressed in a central axis direction 10 of the cylinder with uniform force. At this time, a stem is left without applying force to the bottom. In this composition, a connecting process is unnecessary and costs will be reduced and it is advantage for mass production. And no welding points make good airtightness.
JP10172379A 1979-08-09 1979-08-09 Semiconductor case Pending JPS5626452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10172379A JPS5626452A (en) 1979-08-09 1979-08-09 Semiconductor case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10172379A JPS5626452A (en) 1979-08-09 1979-08-09 Semiconductor case

Publications (1)

Publication Number Publication Date
JPS5626452A true JPS5626452A (en) 1981-03-14

Family

ID=14308211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10172379A Pending JPS5626452A (en) 1979-08-09 1979-08-09 Semiconductor case

Country Status (1)

Country Link
JP (1) JPS5626452A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60232223A (en) * 1984-04-28 1985-11-18 Seibu Giken:Kk Filter element
JPS6186919A (en) * 1984-10-02 1986-05-02 Azumi Roshi Kk Filter material and its preparation
JPS61268327A (en) * 1985-05-23 1986-11-27 Toray Ind Inc Filter material for organic polymer solution
JPH05503182A (en) * 1989-12-15 1993-05-27 ベーリンガー　マンハイム　コーポレーション Regulated branch power supply

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60232223A (en) * 1984-04-28 1985-11-18 Seibu Giken:Kk Filter element
JPS6186919A (en) * 1984-10-02 1986-05-02 Azumi Roshi Kk Filter material and its preparation
JPS61268327A (en) * 1985-05-23 1986-11-27 Toray Ind Inc Filter material for organic polymer solution
JPH05503182A (en) * 1989-12-15 1993-05-27 ベーリンガー　マンハイム　コーポレーション Regulated branch power supply

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