JPS5635023B2 - - Google Patents

Info

Publication number
JPS5635023B2
JPS5635023B2 JP1213880A JP1213880A JPS5635023B2 JP S5635023 B2 JPS5635023 B2 JP S5635023B2 JP 1213880 A JP1213880 A JP 1213880A JP 1213880 A JP1213880 A JP 1213880A JP S5635023 B2 JPS5635023 B2 JP S5635023B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1213880A
Other versions
JPS55148437A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS55148437A publication Critical patent/JPS55148437A/ja
Publication of JPS5635023B2 publication Critical patent/JPS5635023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/44—Filing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/45—Scale remover or preventor
    • Y10T29/4567—Brush type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1213880A 1979-05-07 1980-02-05 Device for adjusting chip position Granted JPS55148437A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/036,912 US4321738A (en) 1979-05-07 1979-05-07 Apparatus and method for rework dressing of a chip site

Publications (2)

Publication Number Publication Date
JPS55148437A JPS55148437A (en) 1980-11-19
JPS5635023B2 true JPS5635023B2 (ja) 1981-08-14

Family

ID=21891356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1213880A Granted JPS55148437A (en) 1979-05-07 1980-02-05 Device for adjusting chip position

Country Status (4)

Country Link
US (1) US4321738A (ja)
EP (1) EP0018557B1 (ja)
JP (1) JPS55148437A (ja)
DE (1) DE3060573D1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046813U (ja) * 1983-09-09 1985-04-02 ヤンマー農機株式会社 播種，施肥装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3737457A1 (de) * 1987-11-04 1989-05-18 Peter Gammelin Loetvorrichtung
JP2827060B2 (ja) * 1991-05-20 1998-11-18 株式会社新川 ボンデイング装置
US5918516A (en) * 1997-02-07 1999-07-06 Unisys Corporation Method of forming I/O columns with open ends that are free of crater-like voids
NO317083B1 (no) * 2002-09-27 2004-08-02 Catalyst Services Inc Fremgangsmate for fylling av partikulaert materiale i vertikale ror
JP4057457B2 (ja) * 2003-04-15 2008-03-05 株式会社ディスコ フリップチップボンダー
BRPI0608479A2 (pt) * 2005-03-25 2010-01-05 Catalyst Services Inc tubos de enchimento com catalisador e/ou outros particulados
US8025472B2 (en) * 2007-06-01 2011-09-27 Catalyst Services, Inc. Catalyst loading system
US10293465B2 (en) * 2014-08-29 2019-05-21 Hzo, Inc. Equipment for removing protective coatings from substrates
MX392527B (es) 2015-04-29 2025-03-24 Clpros Llc Carga de tubos verticales con material particulado.
US10269762B2 (en) * 2015-10-29 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Rework process and tool design for semiconductor package
CN109352090B (zh) * 2018-11-15 2024-10-22 安徽博微长安电子有限公司 快速去除铝合金储能焊接螺柱焊接飞渣的工装及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1145654A (en) * 1914-02-02 1915-07-06 David W Anderson Method of making convexed or concaved bodies of felt or other flexible substances.
US1431917A (en) * 1920-09-11 1922-10-17 Hrant G Antaramian Ornamenting process and apparatus
US2483424A (en) * 1947-03-31 1949-10-04 Electric Terminal Corp Method of soldering terminals for electrical conductors
US3211354A (en) * 1962-04-13 1965-10-12 Dugard Robert Evers Apparatus for desoldering
US3584362A (en) * 1965-04-30 1971-06-15 Ibm Apparatus for wiring ferrite core matrices
GB1243097A (en) * 1969-03-12 1971-08-18 Int Computers Ltd Improvements in or relating to methods of producing patterns of electrical connectors
US3646648A (en) * 1970-06-24 1972-03-07 Benjamin O Kappelman Apparatus for forming rollers for producing a repetition of designs
US3746239A (en) * 1970-11-12 1973-07-17 D Auray Desoldering device
US3751799A (en) * 1972-04-26 1973-08-14 Ibm Solder terminal rework technique
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6046813U (ja) * 1983-09-09 1985-04-02 ヤンマー農機株式会社 播種，施肥装置

Also Published As

Publication number Publication date
DE3060573D1 (en) 1982-08-12
JPS55148437A (en) 1980-11-19
EP0018557B1 (en) 1982-06-23
EP0018557A1 (en) 1980-11-12
US4321738A (en) 1982-03-30

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