JPS5635792A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS5635792A
JPS5635792A JP11011479A JP11011479A JPS5635792A JP S5635792 A JPS5635792 A JP S5635792A JP 11011479 A JP11011479 A JP 11011479A JP 11011479 A JP11011479 A JP 11011479A JP S5635792 A JPS5635792 A JP S5635792A
Authority
JP
Japan
Prior art keywords
plated
masking tape
temp
adhesive
partial plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11011479A
Other languages
Japanese (ja)
Other versions
JPS6058314B2 (en
Inventor
Mamoru Onda
Ryozo Yamagishi
Mitsuhiko Sugiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP11011479A priority Critical patent/JPS6058314B2/en
Publication of JPS5635792A publication Critical patent/JPS5635792A/en
Publication of JPS6058314B2 publication Critical patent/JPS6058314B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prevent squeeze-out and ooze-out of adhesive, by sticking a masking tape on the material to be plated after heating at least one side to be plated of the material or the masking tape, to a prescribed temp.
CONSTITUTION: In partial plating of a material to be plated with a masking tape sticked to the material to be plated, at least the material to be plated is heated previously to 60W180°C temp., then the masking tape is sticked to the material. The masking tape may also be heated at the same time to 40W200°c temp. Hereby the adhesive flows well so as to remove air bubbles, and adhesion force is remarkably increased, hence squeezing-out or oozing-out of the adhesive is prevented.
COPYRIGHT: (C)1981,JPO&Japio
JP11011479A 1979-08-29 1979-08-29 Partial plating method Expired JPS6058314B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11011479A JPS6058314B2 (en) 1979-08-29 1979-08-29 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11011479A JPS6058314B2 (en) 1979-08-29 1979-08-29 Partial plating method

Publications (2)

Publication Number Publication Date
JPS5635792A true JPS5635792A (en) 1981-04-08
JPS6058314B2 JPS6058314B2 (en) 1985-12-19

Family

ID=14527389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11011479A Expired JPS6058314B2 (en) 1979-08-29 1979-08-29 Partial plating method

Country Status (1)

Country Link
JP (1) JPS6058314B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938237A (en) * 1982-08-26 1984-03-02 Keiwa Shoko Kk Production of film with one or both of its side partially metallized

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938237A (en) * 1982-08-26 1984-03-02 Keiwa Shoko Kk Production of film with one or both of its side partially metallized

Also Published As

Publication number Publication date
JPS6058314B2 (en) 1985-12-19

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