JPS5636140Y2 - - Google Patents
Info
- Publication number
- JPS5636140Y2 JPS5636140Y2 JP1977111739U JP11173977U JPS5636140Y2 JP S5636140 Y2 JPS5636140 Y2 JP S5636140Y2 JP 1977111739 U JP1977111739 U JP 1977111739U JP 11173977 U JP11173977 U JP 11173977U JP S5636140 Y2 JPS5636140 Y2 JP S5636140Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977111739U JPS5636140Y2 (fr) | 1977-08-19 | 1977-08-19 | |
| GB7830237A GB2002967B (en) | 1977-08-19 | 1978-07-18 | Integrated circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977111739U JPS5636140Y2 (fr) | 1977-08-19 | 1977-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5438468U JPS5438468U (fr) | 1979-03-13 |
| JPS5636140Y2 true JPS5636140Y2 (fr) | 1981-08-25 |
Family
ID=14568949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977111739U Expired JPS5636140Y2 (fr) | 1977-08-19 | 1977-08-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5636140Y2 (fr) |
| GB (1) | GB2002967B (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57141338A (en) * | 1981-02-26 | 1982-09-01 | Purakoo:Kk | Method and apparatus to wind up synthetic resin film |
| JPH063836B2 (ja) * | 1982-03-31 | 1994-01-12 | 株式会社東芝 | マルチチツプモジュール |
| GB2204184A (en) * | 1987-04-29 | 1988-11-02 | Stanley Bracey | Mounting electronic components on substrates |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127984B2 (fr) * | 1973-06-20 | 1976-08-16 |
-
1977
- 1977-08-19 JP JP1977111739U patent/JPS5636140Y2/ja not_active Expired
-
1978
- 1978-07-18 GB GB7830237A patent/GB2002967B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2002967B (en) | 1982-01-06 |
| GB2002967A (en) | 1979-02-28 |
| JPS5438468U (fr) | 1979-03-13 |