JPS5636562A - Two component adhesive compound - Google Patents
Two component adhesive compoundInfo
- Publication number
- JPS5636562A JPS5636562A JP8906780A JP8906780A JPS5636562A JP S5636562 A JPS5636562 A JP S5636562A JP 8906780 A JP8906780 A JP 8906780A JP 8906780 A JP8906780 A JP 8906780A JP S5636562 A JPS5636562 A JP S5636562A
- Authority
- JP
- Japan
- Prior art keywords
- component adhesive
- adhesive compound
- compound
- component
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 150000001875 compounds Chemical class 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5330879A | 1979-06-29 | 1979-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5636562A true JPS5636562A (en) | 1981-04-09 |
Family
ID=21983310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8906780A Pending JPS5636562A (en) | 1979-06-29 | 1980-06-30 | Two component adhesive compound |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5636562A (en) |
| DE (1) | DE3024161A1 (en) |
| FR (1) | FR2460724A1 (en) |
| GB (1) | GB2051819A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61131524A (en) * | 1984-11-30 | 1986-06-19 | Yokogawa Electric Corp | Semiconductor substrate |
| JPS62199670A (en) * | 1986-02-28 | 1987-09-03 | Tomoegawa Paper Co Ltd | Adhesive composition for die bonding |
| US8814277B2 (en) | 2008-05-19 | 2014-08-26 | Honda Motor Co., Ltd. | Rustproof cover for automobile disk brake |
| JP2016125977A (en) * | 2015-01-08 | 2016-07-11 | 昭和電工株式会社 | Strain gauge adhesion method |
| CN112280511A (en) * | 2020-10-29 | 2021-01-29 | 北京市建筑工程研究院有限责任公司 | Intelligent slow-bonding prestressed steel strand and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1560010B1 (en) * | 2004-01-27 | 2009-09-02 | Mettler-Toledo AG | Load cell with strain gauge with adhesive layer of inorganic-organic hybrid-polymer (ORMOCER) |
| FR3023909B1 (en) * | 2014-07-17 | 2020-11-20 | Centre Techn Ind Mecanique | PROCESS FOR MAKING A STRENGTH SENSOR AND INSTALLATION FOR IMPLEMENTATION |
| WO2023288149A1 (en) * | 2021-07-15 | 2023-01-19 | Henkel Ag & Co., Kgaa | Two-component curable compositions |
-
1980
- 1980-06-11 GB GB8019080A patent/GB2051819A/en not_active Withdrawn
- 1980-06-27 FR FR8014691A patent/FR2460724A1/en not_active Withdrawn
- 1980-06-27 DE DE19803024161 patent/DE3024161A1/en not_active Withdrawn
- 1980-06-30 JP JP8906780A patent/JPS5636562A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61131524A (en) * | 1984-11-30 | 1986-06-19 | Yokogawa Electric Corp | Semiconductor substrate |
| JPS62199670A (en) * | 1986-02-28 | 1987-09-03 | Tomoegawa Paper Co Ltd | Adhesive composition for die bonding |
| US8814277B2 (en) | 2008-05-19 | 2014-08-26 | Honda Motor Co., Ltd. | Rustproof cover for automobile disk brake |
| JP2016125977A (en) * | 2015-01-08 | 2016-07-11 | 昭和電工株式会社 | Strain gauge adhesion method |
| CN112280511A (en) * | 2020-10-29 | 2021-01-29 | 北京市建筑工程研究院有限责任公司 | Intelligent slow-bonding prestressed steel strand and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2051819A (en) | 1981-01-21 |
| DE3024161A1 (en) | 1981-01-08 |
| FR2460724A1 (en) | 1981-01-30 |
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