JPS563693A - Partial plating method for metal - Google Patents
Partial plating method for metalInfo
- Publication number
- JPS563693A JPS563693A JP7889479A JP7889479A JPS563693A JP S563693 A JPS563693 A JP S563693A JP 7889479 A JP7889479 A JP 7889479A JP 7889479 A JP7889479 A JP 7889479A JP S563693 A JPS563693 A JP S563693A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- face
- frame
- covered
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 8
- 239000002184 metal Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE: To enable to carry out partial plating of metal by plating the whole face of groundwork and flaking off the plating of pure face unnecessary to plate.
CONSTITUTION: The frame 1 is formed by wristwatch, that is, plating groundwork, such as stainless steel, brass, etc. and is connected with the cathode 3 of the electroplating bath 2 and then, is electroplated the whole frame. On the one hand, the nonconductive covering body 5 watertightly covered the plating face 4 of outer circumference face of the frame 1 necessary to plate in the frame 1, is formed and the face 4 is covered by the body 5. Next, the frame covered the face 4 by the body 5, is connected with the anode 5 of the bath 2 and current is supplied. On this occasion, plating of pure face not covered by the body 5, is exfoliated in the frame 1 and is dissolved in the plating liquid 8.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7889479A JPS563693A (en) | 1979-06-22 | 1979-06-22 | Partial plating method for metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7889479A JPS563693A (en) | 1979-06-22 | 1979-06-22 | Partial plating method for metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS563693A true JPS563693A (en) | 1981-01-14 |
Family
ID=13674511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7889479A Pending JPS563693A (en) | 1979-06-22 | 1979-06-22 | Partial plating method for metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS563693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6191387A (en) * | 1984-10-09 | 1986-05-09 | Electroplating Eng Of Japan Co | Spray plating method of ic lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956837A (en) * | 1972-10-04 | 1974-06-03 | ||
| JPS51140839A (en) * | 1975-05-30 | 1976-12-04 | Nippon Electric Co | Method of forming coatings of different metals |
-
1979
- 1979-06-22 JP JP7889479A patent/JPS563693A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956837A (en) * | 1972-10-04 | 1974-06-03 | ||
| JPS51140839A (en) * | 1975-05-30 | 1976-12-04 | Nippon Electric Co | Method of forming coatings of different metals |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6191387A (en) * | 1984-10-09 | 1986-05-09 | Electroplating Eng Of Japan Co | Spray plating method of ic lead frame |
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