JPS563693A - Partial plating method for metal - Google Patents

Partial plating method for metal

Info

Publication number
JPS563693A
JPS563693A JP7889479A JP7889479A JPS563693A JP S563693 A JPS563693 A JP S563693A JP 7889479 A JP7889479 A JP 7889479A JP 7889479 A JP7889479 A JP 7889479A JP S563693 A JPS563693 A JP S563693A
Authority
JP
Japan
Prior art keywords
plating
face
frame
covered
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7889479A
Other languages
Japanese (ja)
Inventor
Katsuhiro Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP7889479A priority Critical patent/JPS563693A/en
Publication of JPS563693A publication Critical patent/JPS563693A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE: To enable to carry out partial plating of metal by plating the whole face of groundwork and flaking off the plating of pure face unnecessary to plate.
CONSTITUTION: The frame 1 is formed by wristwatch, that is, plating groundwork, such as stainless steel, brass, etc. and is connected with the cathode 3 of the electroplating bath 2 and then, is electroplated the whole frame. On the one hand, the nonconductive covering body 5 watertightly covered the plating face 4 of outer circumference face of the frame 1 necessary to plate in the frame 1, is formed and the face 4 is covered by the body 5. Next, the frame covered the face 4 by the body 5, is connected with the anode 5 of the bath 2 and current is supplied. On this occasion, plating of pure face not covered by the body 5, is exfoliated in the frame 1 and is dissolved in the plating liquid 8.
COPYRIGHT: (C)1981,JPO&Japio
JP7889479A 1979-06-22 1979-06-22 Partial plating method for metal Pending JPS563693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7889479A JPS563693A (en) 1979-06-22 1979-06-22 Partial plating method for metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7889479A JPS563693A (en) 1979-06-22 1979-06-22 Partial plating method for metal

Publications (1)

Publication Number Publication Date
JPS563693A true JPS563693A (en) 1981-01-14

Family

ID=13674511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7889479A Pending JPS563693A (en) 1979-06-22 1979-06-22 Partial plating method for metal

Country Status (1)

Country Link
JP (1) JPS563693A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191387A (en) * 1984-10-09 1986-05-09 Electroplating Eng Of Japan Co Spray plating method of ic lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956837A (en) * 1972-10-04 1974-06-03
JPS51140839A (en) * 1975-05-30 1976-12-04 Nippon Electric Co Method of forming coatings of different metals

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956837A (en) * 1972-10-04 1974-06-03
JPS51140839A (en) * 1975-05-30 1976-12-04 Nippon Electric Co Method of forming coatings of different metals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191387A (en) * 1984-10-09 1986-05-09 Electroplating Eng Of Japan Co Spray plating method of ic lead frame

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