JPS5637637A - Method and apparatus for taping semiconductor device - Google Patents

Method and apparatus for taping semiconductor device

Info

Publication number
JPS5637637A
JPS5637637A JP11287379A JP11287379A JPS5637637A JP S5637637 A JPS5637637 A JP S5637637A JP 11287379 A JP11287379 A JP 11287379A JP 11287379 A JP11287379 A JP 11287379A JP S5637637 A JPS5637637 A JP S5637637A
Authority
JP
Japan
Prior art keywords
lead frame
cutting
taping
tape
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11287379A
Other languages
Japanese (ja)
Inventor
Yasuhiro Koyama
Kazuaki Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP11287379A priority Critical patent/JPS5637637A/en
Publication of JPS5637637A publication Critical patent/JPS5637637A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the working efficiency and the accuracy by setting a lead frame and a tape at the same position and taping simultaneously with cutting of the lead frame. CONSTITUTION:A lead frame 11 is set on a die 10 of a mold and the frame 11 is cut and separated by a punch 3. Before the cutting, the lead frame is specified in its position by positioning grooves 7 in a rod 4 and attracted by the action of vacuum. The rod 4 is pushed down simultaneously with the cutting of the lead frame to be descended while holding a separated part 17. Then, the part 17 is adhered on a tape 13 laid upon a drum 12. The rod and the punch ascend together with an upper mold, while the tape 18 and the lead frame on the die 10 are moved by one step. According this arrangement, the taping work is carried out simultaneously with the cutting of the lead frame, so that the process for transfer is eliminated and the accuracy of taping position is improved.
JP11287379A 1979-09-05 1979-09-05 Method and apparatus for taping semiconductor device Pending JPS5637637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11287379A JPS5637637A (en) 1979-09-05 1979-09-05 Method and apparatus for taping semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11287379A JPS5637637A (en) 1979-09-05 1979-09-05 Method and apparatus for taping semiconductor device

Publications (1)

Publication Number Publication Date
JPS5637637A true JPS5637637A (en) 1981-04-11

Family

ID=14597656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11287379A Pending JPS5637637A (en) 1979-09-05 1979-09-05 Method and apparatus for taping semiconductor device

Country Status (1)

Country Link
JP (1) JPS5637637A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835847A (en) * 1988-04-20 1989-06-06 International Business Machines Corp. Method and apparatus for mounting a flexible film electronic device carrier on a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835847A (en) * 1988-04-20 1989-06-06 International Business Machines Corp. Method and apparatus for mounting a flexible film electronic device carrier on a substrate

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