JPS5637653A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5637653A JPS5637653A JP11372979A JP11372979A JPS5637653A JP S5637653 A JPS5637653 A JP S5637653A JP 11372979 A JP11372979 A JP 11372979A JP 11372979 A JP11372979 A JP 11372979A JP S5637653 A JPS5637653 A JP S5637653A
- Authority
- JP
- Japan
- Prior art keywords
- film
- phosphorus
- etched
- insulating film
- silicate glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To obtain a wiring layer which is not etched by empolying a laminated film of phosphorus silicate galss containing a silicate glass and a phosphorus in high density as an interlayer insulating film when forming a multilayer wiring layer on an MOSIC or the like, heat treating it, thus flowing an upper layer glass and the etching to remove it. CONSTITUTION:Diffused regions 2, 3 are formed in a semiconducor substrate 1, an insulating film 1' is coated thereon, a first layer wire 4 made of polycrystalline silicon is formed between the regions 2 and 3, and a silicate glass (SiO2)5 becoming an interlayer insulating film is coated on the entire surface. Then, a phosphorus silicate glass film (P2O5-SiO2) 6 containing 15mol% of P2O4 density is formed thereon, is heated in an O2 atmosphere of 1,000 deg.C for approx. ten minutes, and the film 6 is thus flowed. Thereafter, it is dipped in a phosphoric acid solution of a density of 98% as heated to 160 deg.C, and the film 6 is etched and removed. Thus, the retained film 5 becomes a film 5' having rounded corners at the stepped port ion with smooth surface and contains no phosphorus. Accordingly, even if a second aluminum layer wire 7 is formed thereon, it is not etched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11372979A JPS5637653A (en) | 1979-09-04 | 1979-09-04 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11372979A JPS5637653A (en) | 1979-09-04 | 1979-09-04 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5637653A true JPS5637653A (en) | 1981-04-11 |
Family
ID=14619650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11372979A Pending JPS5637653A (en) | 1979-09-04 | 1979-09-04 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5637653A (en) |
-
1979
- 1979-09-04 JP JP11372979A patent/JPS5637653A/en active Pending
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