JPS5641279A - Hot-melt adhesive composition - Google Patents

Hot-melt adhesive composition

Info

Publication number
JPS5641279A
JPS5641279A JP11571479A JP11571479A JPS5641279A JP S5641279 A JPS5641279 A JP S5641279A JP 11571479 A JP11571479 A JP 11571479A JP 11571479 A JP11571479 A JP 11571479A JP S5641279 A JPS5641279 A JP S5641279A
Authority
JP
Japan
Prior art keywords
low
ethylene
resin
copolymer
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11571479A
Other languages
Japanese (ja)
Inventor
Susumu Watanabe
Tomoji Mayuzumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIHEI SEISHI KK
Original Assignee
TAIHEI SEISHI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIHEI SEISHI KK filed Critical TAIHEI SEISHI KK
Priority to JP11571479A priority Critical patent/JPS5641279A/en
Publication of JPS5641279A publication Critical patent/JPS5641279A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: Titled composition which is improved so as not to pollute operational environment and living environment, and which generates no smoke and odor, prepared by mixing an ethylene copolymer, a low MW polyolefin resin and a tackifying resin in a specified mixing weight ratio.
CONSTITUTION: The hot melt adhesive composition is obtained by mixing (a) 20W 60wt% of an ethylene copolymer such as an ethylene-vinyl acetate copolymer, an ethylene-methacrylate ester copolymer or an ethylene-methacrylic acid-vinyl acetate terpolymer, (b) 20W60wt% of a low MW polyolefin resin such as low MW polypropylene oxide, low MW polyethylene, low MW polyethylene oxide or an atactic polypropylene and (c) 0W40wt% of a tackifying resin such as hydrogenated rosin, hydrogenated rosin glycerol ester, a terpene resin or a polyterpene resin.
COPYRIGHT: (C)1981,JPO&Japio
JP11571479A 1979-09-11 1979-09-11 Hot-melt adhesive composition Pending JPS5641279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11571479A JPS5641279A (en) 1979-09-11 1979-09-11 Hot-melt adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11571479A JPS5641279A (en) 1979-09-11 1979-09-11 Hot-melt adhesive composition

Publications (1)

Publication Number Publication Date
JPS5641279A true JPS5641279A (en) 1981-04-17

Family

ID=14669352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11571479A Pending JPS5641279A (en) 1979-09-11 1979-09-11 Hot-melt adhesive composition

Country Status (1)

Country Link
JP (1) JPS5641279A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59217777A (en) * 1983-05-25 1984-12-07 Aica Kogyo Co Ltd Hot-melt adhesive
JPH04202582A (en) * 1990-11-30 1992-07-23 Sekisui Chem Co Ltd Hot-melt adhesive composition
US7173076B2 (en) 2003-09-03 2007-02-06 H.B. Fuller Licensing & Financing Inc Composition and method relating to a hot melt adhesive
JP2007040945A (en) * 2005-08-01 2007-02-15 Chiyoda Technol Corp Device for calibration device for measuring dose such as radiation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59217777A (en) * 1983-05-25 1984-12-07 Aica Kogyo Co Ltd Hot-melt adhesive
JPH04202582A (en) * 1990-11-30 1992-07-23 Sekisui Chem Co Ltd Hot-melt adhesive composition
US7173076B2 (en) 2003-09-03 2007-02-06 H.B. Fuller Licensing & Financing Inc Composition and method relating to a hot melt adhesive
JP2007040945A (en) * 2005-08-01 2007-02-15 Chiyoda Technol Corp Device for calibration device for measuring dose such as radiation

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