JPS5642618A - Molding method for synthetic resin - Google Patents

Molding method for synthetic resin

Info

Publication number
JPS5642618A
JPS5642618A JP11838579A JP11838579A JPS5642618A JP S5642618 A JPS5642618 A JP S5642618A JP 11838579 A JP11838579 A JP 11838579A JP 11838579 A JP11838579 A JP 11838579A JP S5642618 A JPS5642618 A JP S5642618A
Authority
JP
Japan
Prior art keywords
synthetic resin
mold plate
plate
middle plate
upper bottom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11838579A
Other languages
Japanese (ja)
Inventor
Ryoichi Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP11838579A priority Critical patent/JPS5642618A/en
Publication of JPS5642618A publication Critical patent/JPS5642618A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To enable transferring of an embossed pattern on a mold plate without mixing air into synthetic resin, by a method wherein a flat middle plate having a deformation property is placed on a mold plate in which an embossed pattern is formed, and the middle plate is adhered closely to the mold plate after pouring the synthetic resin onto the middle plate.
CONSTITUTION: A flat middle plate 4 having a deformation property is placed on a mold plate 1 in which an embossed pattern 3 is formed in an upper bottom surface 2. After uncured synthetic resin 7 is poured onto said middle plate, air above the upper bottom surface 2 of the mold plate 1 is sucked by means of a vacuum pump 13, and the middle plate 4 is adhered closely to the upper bottom surface 2 of the mold plate 1. With this the synthetic resin 7 is cured. This permits the transfer of a pattern of the mold plate without bring air into the synthetic resin.
COPYRIGHT: (C)1981,JPO&Japio
JP11838579A 1979-09-14 1979-09-14 Molding method for synthetic resin Pending JPS5642618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11838579A JPS5642618A (en) 1979-09-14 1979-09-14 Molding method for synthetic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11838579A JPS5642618A (en) 1979-09-14 1979-09-14 Molding method for synthetic resin

Publications (1)

Publication Number Publication Date
JPS5642618A true JPS5642618A (en) 1981-04-20

Family

ID=14735376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11838579A Pending JPS5642618A (en) 1979-09-14 1979-09-14 Molding method for synthetic resin

Country Status (1)

Country Link
JP (1) JPS5642618A (en)

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