JPS564359B2 - - Google Patents
Info
- Publication number
- JPS564359B2 JPS564359B2 JP8722975A JP8722975A JPS564359B2 JP S564359 B2 JPS564359 B2 JP S564359B2 JP 8722975 A JP8722975 A JP 8722975A JP 8722975 A JP8722975 A JP 8722975A JP S564359 B2 JPS564359 B2 JP S564359B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8722975A JPS5211148A (en) | 1975-07-18 | 1975-07-18 | High temperature solder for aluminium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8722975A JPS5211148A (en) | 1975-07-18 | 1975-07-18 | High temperature solder for aluminium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5211148A JPS5211148A (en) | 1977-01-27 |
| JPS564359B2 true JPS564359B2 (en) | 1981-01-29 |
Family
ID=13909023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8722975A Granted JPS5211148A (en) | 1975-07-18 | 1975-07-18 | High temperature solder for aluminium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5211148A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104073685A (en) * | 2014-06-17 | 2014-10-01 | 宁波博威合金材料股份有限公司 | High-intensity creep-resistant and low-copper alloy material and application thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5767142A (en) * | 1980-10-08 | 1982-04-23 | Hitachi Ltd | Low-temperature aluminum solder |
| JPS63309391A (en) * | 1987-06-12 | 1988-12-16 | Mitsubishi Alum Co Ltd | Brazing filler metal for aluminum |
| JP2010069502A (en) * | 2008-09-18 | 2010-04-02 | Tokyo Bureizu Kk | Micro-alloy solder |
-
1975
- 1975-07-18 JP JP8722975A patent/JPS5211148A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104073685A (en) * | 2014-06-17 | 2014-10-01 | 宁波博威合金材料股份有限公司 | High-intensity creep-resistant and low-copper alloy material and application thereof |
| CN104073685B (en) * | 2014-06-17 | 2016-08-17 | 宁波博威合金材料股份有限公司 | A kind of high-strength creep resistant dilute copper alloy material and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5211148A (en) | 1977-01-27 |