JPS5643796A - Forming viaahole - Google Patents

Forming viaahole

Info

Publication number
JPS5643796A
JPS5643796A JP11900179A JP11900179A JPS5643796A JP S5643796 A JPS5643796 A JP S5643796A JP 11900179 A JP11900179 A JP 11900179A JP 11900179 A JP11900179 A JP 11900179A JP S5643796 A JPS5643796 A JP S5643796A
Authority
JP
Japan
Prior art keywords
viaahole
forming
forming viaahole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11900179A
Other languages
Japanese (ja)
Other versions
JPS5843917B2 (en
Inventor
Nobuo Kamehara
Hirozou Yokoyama
Kouichi Niwa
Kiyouhei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11900179A priority Critical patent/JPS5843917B2/en
Publication of JPS5643796A publication Critical patent/JPS5643796A/en
Publication of JPS5843917B2 publication Critical patent/JPS5843917B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP11900179A 1979-09-17 1979-09-17 How to form a via hole Expired JPS5843917B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11900179A JPS5843917B2 (en) 1979-09-17 1979-09-17 How to form a via hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11900179A JPS5843917B2 (en) 1979-09-17 1979-09-17 How to form a via hole

Publications (2)

Publication Number Publication Date
JPS5643796A true JPS5643796A (en) 1981-04-22
JPS5843917B2 JPS5843917B2 (en) 1983-09-29

Family

ID=14750535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11900179A Expired JPS5843917B2 (en) 1979-09-17 1979-09-17 How to form a via hole

Country Status (1)

Country Link
JP (1) JPS5843917B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59231890A (en) * 1983-06-14 1984-12-26 日立化成工業株式会社 Method of forming through hole conductor
JPH0818065A (en) * 1995-07-03 1996-01-19 Semiconductor Energy Lab Co Ltd Manufacture of insulated gate type semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1284481A (en) * 1969-01-13 1972-08-09 Bunker Ramo Connector plate for interconnecting adjacent surfaces of laminar circuits and method of making
JPS49121172A (en) * 1973-03-28 1974-11-19
JPS49121967A (en) * 1973-03-31 1974-11-21

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1284481A (en) * 1969-01-13 1972-08-09 Bunker Ramo Connector plate for interconnecting adjacent surfaces of laminar circuits and method of making
JPS49121172A (en) * 1973-03-28 1974-11-19
JPS49121967A (en) * 1973-03-31 1974-11-21

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59231890A (en) * 1983-06-14 1984-12-26 日立化成工業株式会社 Method of forming through hole conductor
JPH0818065A (en) * 1995-07-03 1996-01-19 Semiconductor Energy Lab Co Ltd Manufacture of insulated gate type semiconductor device

Also Published As

Publication number Publication date
JPS5843917B2 (en) 1983-09-29

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