JPS5645264A - Soft soldering method of slender object - Google Patents

Soft soldering method of slender object

Info

Publication number
JPS5645264A
JPS5645264A JP11931479A JP11931479A JPS5645264A JP S5645264 A JPS5645264 A JP S5645264A JP 11931479 A JP11931479 A JP 11931479A JP 11931479 A JP11931479 A JP 11931479A JP S5645264 A JPS5645264 A JP S5645264A
Authority
JP
Japan
Prior art keywords
temperature
soft
soldering
soft solder
heating source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11931479A
Other languages
Japanese (ja)
Inventor
Teruo Yamaguchi
Yoshio Imajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11931479A priority Critical patent/JPS5645264A/en
Publication of JPS5645264A publication Critical patent/JPS5645264A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To stabilize the rate of adhering of soft soldering in a method of soft soldering a slender object to a base metal by measuring the temperature of the molten soft solder and controlling the intensity of a heating source.
CONSTITUTION: A notch 6a, a thermocouple 7 for measuring soft solder temperature and a thermocoupler 8 for measuring coil conductor temperature are provided to a retaining member 6 in contact with the soldering part. A cooling pipe 2 is inserted into the groove 1a of a coil conductor 1. A heating device 4 is ignited to obtain a heating source 4a. The retaining member 6 is abutted on the coil conductor 1 and its surface temperature is measured with the thermocouple 8. When the soft solder melting temperature is reached, a soft solder 3 is melted in the notch 6a and is supplied to the joining part. Upon starting of the soldering, the soft solder temperature of the notch 6a is measured with the thermocouple 7 and the signal thereof causes a separately provided control unit to control the intensity of the heating source 4a. While the molten soft solder temperature is being maintained constant, the heating source 4a and retaining member 6 are moved along the cooling pipe, whereby the soft soldering is accomplished.
COPYRIGHT: (C)1981,JPO&Japio
JP11931479A 1979-09-19 1979-09-19 Soft soldering method of slender object Pending JPS5645264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11931479A JPS5645264A (en) 1979-09-19 1979-09-19 Soft soldering method of slender object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11931479A JPS5645264A (en) 1979-09-19 1979-09-19 Soft soldering method of slender object

Publications (1)

Publication Number Publication Date
JPS5645264A true JPS5645264A (en) 1981-04-24

Family

ID=14758368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11931479A Pending JPS5645264A (en) 1979-09-19 1979-09-19 Soft soldering method of slender object

Country Status (1)

Country Link
JP (1) JPS5645264A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092025A (en) * 1983-10-26 1985-05-23 Isuzu Motors Ltd Coupled structure of ceramics shaft and metallic shaft
JPS60216935A (en) * 1984-04-11 1985-10-30 Mitsuba Denki Seisakusho:Kk Joining method of metallic member
JP2008086276A (en) * 2006-10-03 2008-04-17 Shosando:Kk Paper pinching tool
CN104014897A (en) * 2014-06-11 2014-09-03 沈阳飞机工业(集团)有限公司 Metal conduit welding technology control method
JP2015112634A (en) * 2013-12-13 2015-06-22 信号器材株式会社 Clamp jig for rail bond weld

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092025A (en) * 1983-10-26 1985-05-23 Isuzu Motors Ltd Coupled structure of ceramics shaft and metallic shaft
JPS60216935A (en) * 1984-04-11 1985-10-30 Mitsuba Denki Seisakusho:Kk Joining method of metallic member
JP2008086276A (en) * 2006-10-03 2008-04-17 Shosando:Kk Paper pinching tool
JP2015112634A (en) * 2013-12-13 2015-06-22 信号器材株式会社 Clamp jig for rail bond weld
CN104014897A (en) * 2014-06-11 2014-09-03 沈阳飞机工业(集团)有限公司 Metal conduit welding technology control method

Similar Documents

Publication Publication Date Title
DE3269653D1 (en) Soldering device and method
JPS52143755A (en) Laser, zone melting device
GB1305291A (en)
EP1029625A3 (en) Muffle convection brazing and annealing system and method
EP0268254A3 (en) Method and device for fastening bare glass-fibres detachably in a splicing device
EP0196243A3 (en) Temperature gradient furnace for materials processing
SE8601977L (en) PROCEDURAL EQUIPMENT FOR WELDING
SE9800580D0 (en) Apparatus and method for thermal analysis of metal melts
JPS56102375A (en) Welding method
ATE93430T1 (en) PROCESS FOR CONTROLLING THE TEMPERATURE PROCESS AT SOLDERING JOINTS DURING LASER SOLDERING.
JPS541676A (en) Temperature measuring method of metal surfaces
GB1530029A (en) Soldering instruments
JPS56158270A (en) Soldering method and soldering iron
JPS5659530A (en) Manufacture of wire rod having uniform diameter
SE8804583D0 (en) PROCEDURES FOR RECEIVING BIMETALLIC PRODUCTS
JPS56117134A (en) Temperature measuring device for high heat substance
JPH075688Y2 (en) Electrothermal square waveguide flange brazing jig device
JPS56139276A (en) Soldering device
ES267964Y (en) CONTACT ELECTRODE FOR MELTING FURNACES
JPS56139275A (en) Soldering device
JPS5626674A (en) Method and device for soldering
JPS54477A (en) Switching circuit for lighting apparatus
JPS543581A (en) Temperature measuring apparatus
DE59002441D1 (en) Process for guiding the temperature profile at soldering points during laser soldering.
JPS55109566A (en) Automatic soldering device