JPS5645367A - Liquid waxxless mounting tool for wafer with minute size - Google Patents

Liquid waxxless mounting tool for wafer with minute size

Info

Publication number
JPS5645367A
JPS5645367A JP10909680A JP10909680A JPS5645367A JP S5645367 A JPS5645367 A JP S5645367A JP 10909680 A JP10909680 A JP 10909680A JP 10909680 A JP10909680 A JP 10909680A JP S5645367 A JPS5645367 A JP S5645367A
Authority
JP
Japan
Prior art keywords
waxxless
wafer
liquid
mounting tool
minute size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10909680A
Other languages
Japanese (ja)
Other versions
JPS6059113B2 (en
Inventor
Bui Sesuna Jiyosefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Publication of JPS5645367A publication Critical patent/JPS5645367A/en
Publication of JPS6059113B2 publication Critical patent/JPS6059113B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP55109096A 1979-09-18 1980-08-07 Liquid-free wax attachment for micro-sized wafers Expired JPS6059113B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7667079A 1979-09-18 1979-09-18
US76670 1979-09-18

Publications (2)

Publication Number Publication Date
JPS5645367A true JPS5645367A (en) 1981-04-25
JPS6059113B2 JPS6059113B2 (en) 1985-12-23

Family

ID=22133499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55109096A Expired JPS6059113B2 (en) 1979-09-18 1980-08-07 Liquid-free wax attachment for micro-sized wafers

Country Status (5)

Country Link
JP (1) JPS6059113B2 (en)
DE (1) DE3033944C2 (en)
FR (1) FR2465563A1 (en)
GB (1) GB2058620B (en)
IT (1) IT1129028B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840356U (en) * 1981-09-10 1983-03-16 株式会社三興技研 Protective equipment for abrasive workpieces
JPS61192474A (en) * 1985-02-19 1986-08-27 Sanyo Electric Co Ltd Chip polishing jig
JPS61284374A (en) * 1985-06-07 1986-12-15 Hirabayashi:Kk Method for cutting hard and brittle material and adhesive used therein
JPS6392439A (en) * 1986-10-07 1988-04-22 Toyoda Gosei Co Ltd Apparatus for controlling pitch of reinforcing threads

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074018U (en) * 1983-10-26 1985-05-24 新神戸電機株式会社 Storage battery liquid loss/temperature detection sensor
US4534536A (en) * 1984-06-08 1985-08-13 Buehler Ltd. Apparatus for mounting samples for polishing
JPS6372517U (en) * 1986-10-29 1988-05-14
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
WO1994017956A1 (en) * 1993-02-12 1994-08-18 Kondratenko Vladimir Stepanovi Process for machining components made of brittle materials and a device for carrying out the same
JP3042293B2 (en) * 1994-02-18 2000-05-15 信越半導体株式会社 Wafer polishing equipment
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
CN111318929B (en) * 2020-03-11 2025-02-18 济源创新石化配件有限公司 A high-precision grinding machine for surface processing of sealing parts
CN115377086A (en) * 2022-08-10 2022-11-22 中国电子科技集团公司第十一研究所 Thinning method of indium antimonide infrared detector
CN120754967A (en) * 2023-06-30 2025-10-10 江苏鑫华半导体科技股份有限公司 Electronic grade polycrystalline silicon rod crushing method and system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2112636A (en) * 1936-09-02 1938-03-29 Brush Dev Co Method of making piezoelectric units
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840356U (en) * 1981-09-10 1983-03-16 株式会社三興技研 Protective equipment for abrasive workpieces
JPS61192474A (en) * 1985-02-19 1986-08-27 Sanyo Electric Co Ltd Chip polishing jig
JPS61284374A (en) * 1985-06-07 1986-12-15 Hirabayashi:Kk Method for cutting hard and brittle material and adhesive used therein
JPS6392439A (en) * 1986-10-07 1988-04-22 Toyoda Gosei Co Ltd Apparatus for controlling pitch of reinforcing threads

Also Published As

Publication number Publication date
IT8049624A0 (en) 1980-09-05
GB2058620A (en) 1981-04-15
FR2465563B3 (en) 1982-05-21
DE3033944C2 (en) 1985-07-11
DE3033944A1 (en) 1981-04-02
JPS6059113B2 (en) 1985-12-23
IT1129028B (en) 1986-06-04
GB2058620B (en) 1982-11-17
FR2465563A1 (en) 1981-03-27

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