JPS5646512A - High voltage power supply - Google Patents

High voltage power supply

Info

Publication number
JPS5646512A
JPS5646512A JP12260779A JP12260779A JPS5646512A JP S5646512 A JPS5646512 A JP S5646512A JP 12260779 A JP12260779 A JP 12260779A JP 12260779 A JP12260779 A JP 12260779A JP S5646512 A JPS5646512 A JP S5646512A
Authority
JP
Japan
Prior art keywords
compound
melting point
high voltage
molded
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12260779A
Other languages
Japanese (ja)
Inventor
Sadaji Shimokawa
Shunichi Inamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Electric Equipment Corp
Original Assignee
Toshiba Electric Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Electric Equipment Corp filed Critical Toshiba Electric Equipment Corp
Priority to JP12260779A priority Critical patent/JPS5646512A/en
Publication of JPS5646512A publication Critical patent/JPS5646512A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Insulating Of Coils (AREA)
  • Regulation Of General Use Transformers (AREA)

Abstract

PURPOSE:To prevent the yield of voids and the effluence of compound by molding a high-voltage portion with the thermoplastic compound having a low-melting point, and further molding the outer periphery thereof with the thermoplastic compound having a high melting point. CONSTITUTION:A high voltage power supply circuit 2 is molded with thermoplastic compound 7 having a low melting point, and the outer periphery of said compound 7 is molded with thermoplastic compound 8 having the melting point higher than that of the compound 7. Therefore, the yield of voids can be well prevented even though the periphery of the circuit 2 is molded at a low temperature, and the coils of a high voltage transformer 4 is not damaged. Furthermore, even though the transformer 4 is operated and heated and the compound 7 is softened, the compound 7 is blocked by the compound 8 and does not flow out.
JP12260779A 1979-09-26 1979-09-26 High voltage power supply Pending JPS5646512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12260779A JPS5646512A (en) 1979-09-26 1979-09-26 High voltage power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12260779A JPS5646512A (en) 1979-09-26 1979-09-26 High voltage power supply

Publications (1)

Publication Number Publication Date
JPS5646512A true JPS5646512A (en) 1981-04-27

Family

ID=14840122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12260779A Pending JPS5646512A (en) 1979-09-26 1979-09-26 High voltage power supply

Country Status (1)

Country Link
JP (1) JPS5646512A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6071679A (en) * 1983-09-28 1985-04-23 Nitto Electric Ind Co Ltd Pressure-sensitive adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6071679A (en) * 1983-09-28 1985-04-23 Nitto Electric Ind Co Ltd Pressure-sensitive adhesive tape

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