JPS5647268A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS5647268A JPS5647268A JP12349779A JP12349779A JPS5647268A JP S5647268 A JPS5647268 A JP S5647268A JP 12349779 A JP12349779 A JP 12349779A JP 12349779 A JP12349779 A JP 12349779A JP S5647268 A JPS5647268 A JP S5647268A
- Authority
- JP
- Japan
- Prior art keywords
- frame body
- soldering
- soldering device
- guide rails
- printed substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To compactify a soldering device and improve working efficiency by forming the carrier itself into a self-running structure.
CONSTITUTION: After printed substrates are set to a frame body 1, the frame body is fed to the guide rail line of the soldering device. When the right and left current collectors 16 provided on both sides of the frame body 1 make sliding contact with the power feed belts 24, 26 disposed parallel to guide rails 27, the power is supplied to a motor 5 which in turn drives a front wheel 2 by way of a transmission mechaism, causing the frame body, that is, carrier A, to run by itself. And while it is being guided by the guide rails 27, it goes through required processes to complete soldering on the printed substrates. Hence, the accurate soldering work may be performed highly efficiently.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12349779A JPS5647268A (en) | 1979-09-25 | 1979-09-25 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12349779A JPS5647268A (en) | 1979-09-25 | 1979-09-25 | Soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5647268A true JPS5647268A (en) | 1981-04-28 |
| JPS6257429B2 JPS6257429B2 (en) | 1987-12-01 |
Family
ID=14862082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12349779A Granted JPS5647268A (en) | 1979-09-25 | 1979-09-25 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5647268A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5064981A (en) * | 1973-10-15 | 1975-06-02 | ||
| JPS51151392U (en) * | 1975-05-28 | 1976-12-03 |
-
1979
- 1979-09-25 JP JP12349779A patent/JPS5647268A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5064981A (en) * | 1973-10-15 | 1975-06-02 | ||
| JPS51151392U (en) * | 1975-05-28 | 1976-12-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6257429B2 (en) | 1987-12-01 |
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