JPS5647433A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5647433A JPS5647433A JP12318679A JP12318679A JPS5647433A JP S5647433 A JPS5647433 A JP S5647433A JP 12318679 A JP12318679 A JP 12318679A JP 12318679 A JP12318679 A JP 12318679A JP S5647433 A JPS5647433 A JP S5647433A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- compounds
- catalyst
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 4
- -1 imidazole compound Chemical class 0.000 abstract 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 abstract 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 2
- 150000002460 imidazoles Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- AXFVIWBTKYFOCY-UHFFFAOYSA-N 1-n,1-n,3-n,3-n-tetramethylbutane-1,3-diamine Chemical compound CN(C)C(C)CCN(C)C AXFVIWBTKYFOCY-UHFFFAOYSA-N 0.000 abstract 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 239000011951 cationic catalyst Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Landscapes
- Polyethers (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Abstract
PURPOSE: To prepare a rapid-curing long-life thermosetting resin composition suitable for sealing of electronic parts, forming of printed circuit boards, etc. by compounding a bis (trioxaspirononyl) compound and an imidazole compound.
CONSTITUTION: A bis [1,4,6-trioxaspiro(4.4)nonyl] compound of formula (R is bivalent organic group) is prepared by reacting a bifunctional epoxy compound such as bisphenol A diglycidyl ether with γ-butyrolactone in the presence of a cationic catalyst such as BF3.ether complex. The objective thermoplastic resin composition is prepared by adding ≤10wt% of a curing catalyst comprising imidazole compounds such as 2-methylimidazole, or a mixture of imidazole compounds and tertiary amine compounds such as tetramethylbutanediamine, etc. The catalyst may be a mixture of two or more compounds.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12318679A JPS6030337B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12318679A JPS6030337B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5647433A true JPS5647433A (en) | 1981-04-30 |
| JPS6030337B2 JPS6030337B2 (en) | 1985-07-16 |
Family
ID=14854313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12318679A Expired JPS6030337B2 (en) | 1979-09-27 | 1979-09-27 | thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6030337B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6154653A (en) * | 1984-08-25 | 1986-03-18 | Kyocera Corp | Sealing body for electronics parts and its manufacturing method |
| US4599155A (en) * | 1983-09-22 | 1986-07-08 | Kabushiki Kaisha Toshiba | Resin composition |
-
1979
- 1979-09-27 JP JP12318679A patent/JPS6030337B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4599155A (en) * | 1983-09-22 | 1986-07-08 | Kabushiki Kaisha Toshiba | Resin composition |
| JPS6154653A (en) * | 1984-08-25 | 1986-03-18 | Kyocera Corp | Sealing body for electronics parts and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6030337B2 (en) | 1985-07-16 |
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