JPS5647966Y2 - - Google Patents
Info
- Publication number
- JPS5647966Y2 JPS5647966Y2 JP1976059289U JP5928976U JPS5647966Y2 JP S5647966 Y2 JPS5647966 Y2 JP S5647966Y2 JP 1976059289 U JP1976059289 U JP 1976059289U JP 5928976 U JP5928976 U JP 5928976U JP S5647966 Y2 JPS5647966 Y2 JP S5647966Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976059289U JPS5647966Y2 (da) | 1976-05-10 | 1976-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976059289U JPS5647966Y2 (da) | 1976-05-10 | 1976-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52149653U JPS52149653U (da) | 1977-11-12 |
| JPS5647966Y2 true JPS5647966Y2 (da) | 1981-11-10 |
Family
ID=28518783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976059289U Expired JPS5647966Y2 (da) | 1976-05-10 | 1976-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5647966Y2 (da) |
-
1976
- 1976-05-10 JP JP1976059289U patent/JPS5647966Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52149653U (da) | 1977-11-12 |