JPS56500516A - - Google Patents

Info

Publication number
JPS56500516A
JPS56500516A JP50116980A JP50116980A JPS56500516A JP S56500516 A JPS56500516 A JP S56500516A JP 50116980 A JP50116980 A JP 50116980A JP 50116980 A JP50116980 A JP 50116980A JP S56500516 A JPS56500516 A JP S56500516A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50116980A
Other versions
JPS5941319B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/032,339 external-priority patent/US4230553A/en
Application filed filed Critical
Publication of JPS56500516A publication Critical patent/JPS56500516A/ja
Publication of JPS5941319B2 publication Critical patent/JPS5941319B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
JP55501169A 1979-04-23 1980-04-09 多層プリント基板の処理 Expired JPS5941319B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US000000032339 1979-04-23
US06/032,339 US4230553A (en) 1979-04-23 1979-04-23 Treating multilayer printed wiring boards
US000000113117 1980-01-17
US06/113,117 US4277321A (en) 1979-04-23 1980-01-17 Treating multilayer printed wiring boards

Publications (2)

Publication Number Publication Date
JPS56500516A true JPS56500516A (ja) 1981-04-16
JPS5941319B2 JPS5941319B2 (ja) 1984-10-05

Family

ID=26708285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55501169A Expired JPS5941319B2 (ja) 1979-04-23 1980-04-09 多層プリント基板の処理

Country Status (6)

Country Link
US (1) US4277321A (ja)
EP (1) EP0027142B1 (ja)
JP (1) JPS5941319B2 (ja)
CA (1) CA1128896A (ja)
DE (1) DE3068654D1 (ja)
WO (1) WO1980002353A1 (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
US4399014A (en) * 1980-05-03 1983-08-16 Engle Frank W Plasma reactor and method therefor
US4289598A (en) * 1980-05-03 1981-09-15 Technics, Inc. Plasma reactor and method therefor
US4425210A (en) 1980-11-04 1984-01-10 Fazlin Fazal A Plasma desmearing apparatus and method
DE3041551A1 (de) * 1980-11-04 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Elektroden fuer plasma-aetzanlage
US4381965A (en) * 1982-01-06 1983-05-03 Drytek, Inc. Multi-planar electrode plasma etching
US4472238A (en) * 1983-12-05 1984-09-18 E. I. Du Pont De Nemours And Company Process using plasma for forming conductive through-holes through a dielectric layer
US4496420A (en) * 1984-04-06 1985-01-29 Bmc Industries, Inc. Process for plasma desmear etching of printed circuit boards and apparatus used therein
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
JPS61179506U (ja) * 1985-03-28 1986-11-08
US4624738A (en) * 1985-07-12 1986-11-25 E. T. Plasma, Inc. Continuous gas plasma etching apparatus and method
EP0208012B1 (de) * 1985-07-12 1991-09-25 Ibm Deutschland Gmbh Verfahren zum Herstellen von verschmierungsfreien Bohrungen
US4908094A (en) * 1986-04-14 1990-03-13 International Business Machines Corporation Method for laminating organic materials via surface modification
US4689111A (en) * 1986-10-28 1987-08-25 International Business Machines Corp. Process for promoting the interlaminate adhesion of polymeric materials to metal surfaces
WO1995002312A1 (de) * 1993-07-07 1995-01-19 Dyconex Patente Ag Strukturierte leiterplatten und folienleiterplatten und verfahren zu deren herstellung
US5643639A (en) * 1994-12-22 1997-07-01 Research Triangle Institute Plasma treatment method for treatment of a large-area work surface apparatus and methods
TW310461B (ja) * 1995-11-10 1997-07-11 Matsushita Electric Industrial Co Ltd
US6264812B1 (en) 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6254737B1 (en) 1996-10-08 2001-07-03 Applied Materials, Inc. Active shield for generating a plasma for sputtering
US20030048591A1 (en) * 2001-09-10 2003-03-13 Saturn Vac Co., Ltd. Desmearing process/apparatus for pulse-type D.C. plasma
DE102019002647A1 (de) * 2019-04-10 2020-10-15 Plasmetrex Gmbh Waferboot und Behandlungsvorrichtung für Wafer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3410774A (en) * 1965-10-23 1968-11-12 Ibm Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece
US3598710A (en) * 1966-04-04 1971-08-10 Ibm Etching method
US3705055A (en) * 1970-09-18 1972-12-05 Western Electric Co Method of descumming photoresist patterns
US3867216A (en) * 1972-05-12 1975-02-18 Adir Jacob Process and material for manufacturing semiconductor devices
US3930913A (en) * 1974-07-18 1976-01-06 Lfe Corporation Process for manufacturing integrated circuits and metallic mesh screens
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards

Also Published As

Publication number Publication date
CA1128896A (en) 1982-08-03
EP0027142A4 (en) 1982-08-11
DE3068654D1 (en) 1984-08-30
JPS5941319B2 (ja) 1984-10-05
US4277321A (en) 1981-07-07
WO1980002353A1 (en) 1980-10-30
EP0027142A1 (en) 1981-04-22
EP0027142B1 (en) 1984-07-25

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