JPS56501226A - - Google Patents
Info
- Publication number
- JPS56501226A JPS56501226A JP50204080A JP50204080A JPS56501226A JP S56501226 A JPS56501226 A JP S56501226A JP 50204080 A JP50204080 A JP 50204080A JP 50204080 A JP50204080 A JP 50204080A JP S56501226 A JPS56501226 A JP S56501226A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
- G01N17/02—Electrochemical measuring systems for weathering, corrosion or corrosion-protection measurement
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
- H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental Sciences (AREA)
- Analytical Chemistry (AREA)
- Ecology (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Weting (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7140879A | 1979-08-30 | 1979-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56501226A true JPS56501226A (2) | 1981-08-27 |
Family
ID=22101119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50204080A Pending JPS56501226A (2) | 1979-08-30 | 1980-07-28 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0035529A4 (2) |
| JP (1) | JPS56501226A (2) |
| WO (1) | WO1981000646A1 (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755442A (en) * | 1985-08-19 | 1988-07-05 | Kabushiki Kaisha Toshiba | Pattern developing process and apparatus therefor |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3581010D1 (de) * | 1984-07-09 | 1991-02-07 | Sigma Corp | Entwicklung-endpunktnachweisverfahren. |
| US4662975A (en) * | 1986-02-10 | 1987-05-05 | The Boeing Company | Apparatus for determining the etch rate of nonconductive materials |
| US5573624A (en) * | 1992-12-04 | 1996-11-12 | International Business Machines Corporation | Chemical etch monitor for measuring film etching uniformity during a chemical etching process |
| US5788801A (en) * | 1992-12-04 | 1998-08-04 | International Business Machines Corporation | Real time measurement of etch rate during a chemical etching process |
| US5582746A (en) * | 1992-12-04 | 1996-12-10 | International Business Machines Corporation | Real time measurement of etch rate during a chemical etching process |
| US5489361A (en) * | 1994-06-30 | 1996-02-06 | International Business Machines Corporation | Measuring film etching uniformity during a chemical etching process |
| US5516399A (en) * | 1994-06-30 | 1996-05-14 | International Business Machines Corporation | Contactless real-time in-situ monitoring of a chemical etching |
| US5501766A (en) * | 1994-06-30 | 1996-03-26 | International Business Machines Corporation | Minimizing overetch during a chemical etching process |
| US5445705A (en) * | 1994-06-30 | 1995-08-29 | International Business Machines Corporation | Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process |
| US5480511A (en) * | 1994-06-30 | 1996-01-02 | International Business Machines Corporation | Method for contactless real-time in-situ monitoring of a chemical etching process |
| FR2772926B1 (fr) * | 1997-12-24 | 2000-03-10 | Cis Bio Int | Dispositif et procede de test d'elements sensibles d'une puce electronique |
| DE10111803A1 (de) * | 2001-03-12 | 2002-06-27 | Infineon Technologies Ag | Anordnung und Verfahren zum rückseitigen Kontaktieren eines Halbleitersubstrats |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3553052A (en) * | 1965-10-24 | 1971-01-05 | Louis A Scholz | Etching control device |
| US3475242A (en) * | 1966-12-19 | 1969-10-28 | Fmc Corp | Process and apparatus for controlling metal etching operation |
| US3874959A (en) * | 1973-09-21 | 1975-04-01 | Ibm | Method to establish the endpoint during the delineation of oxides on semiconductor surfaces and apparatus therefor |
| US4039370A (en) * | 1975-06-23 | 1977-08-02 | Rca Corporation | Optically monitoring the undercutting of a layer being etched |
| US4080246A (en) * | 1976-06-29 | 1978-03-21 | Gaf Corporation | Novel etching composition and method for using same |
-
1980
- 1980-07-28 JP JP50204080A patent/JPS56501226A/ja active Pending
- 1980-07-28 WO PCT/US1980/000934 patent/WO1981000646A1/en not_active Ceased
-
1981
- 1981-03-09 EP EP19800901737 patent/EP0035529A4/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755442A (en) * | 1985-08-19 | 1988-07-05 | Kabushiki Kaisha Toshiba | Pattern developing process and apparatus therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0035529A4 (en) | 1982-02-16 |
| WO1981000646A1 (en) | 1981-03-05 |
| EP0035529A1 (en) | 1981-09-16 |