JPS5651864A - Semiconductor switching element - Google Patents
Semiconductor switching elementInfo
- Publication number
- JPS5651864A JPS5651864A JP12767279A JP12767279A JPS5651864A JP S5651864 A JPS5651864 A JP S5651864A JP 12767279 A JP12767279 A JP 12767279A JP 12767279 A JP12767279 A JP 12767279A JP S5651864 A JPS5651864 A JP S5651864A
- Authority
- JP
- Japan
- Prior art keywords
- type
- layer
- substrate
- gate
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/131—Thyristors having built-in components
- H10D84/133—Thyristors having built-in components the built-in components being capacitors or resistors
Landscapes
- Thyristors (AREA)
Abstract
PURPOSE:To obtain the switching element capable of compensating the low breakdown voltage and having a breakdown voltage equal to that of SCR of a substrate by incorporating a diffused resistor into a semiconductor substrate in one body and selecting the diffused position. CONSTITUTION:Side wall of an element is provided with an N type substrate 1 equipped with separate diffusion 2 of P type impurity. A P type anode layer 3 is attached onto the reverse side and an annular P type gate layer 4 is formed on the surface, and a P type diffused resistor 5 is formed in a region 1a caught between the gate layers. As the resistor layer 5 is surrounded by a depletion layer stretching around the gate layer 4 at the time of its operation, it is possible to obtain a sufficiently high breakdown voltage almost equal to that of SCR or the substrate. And then, an N type cathode layer 6 and an N type protective ring 7 are provided, a window 11 for the gate is provided on an insulation film 8, and a window 8 for the resistor is provided on the gate layer in a position capable of obtaining the required resistance value from the terminal connected in the substrate, and then, the windows 10 and 8 are connected with each other by an Al electrode 9. It is possible, by using this constitution, to obtain the switching element of high capability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12767279A JPS5651864A (en) | 1979-10-02 | 1979-10-02 | Semiconductor switching element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12767279A JPS5651864A (en) | 1979-10-02 | 1979-10-02 | Semiconductor switching element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5651864A true JPS5651864A (en) | 1981-05-09 |
| JPS6148788B2 JPS6148788B2 (en) | 1986-10-25 |
Family
ID=14965856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12767279A Granted JPS5651864A (en) | 1979-10-02 | 1979-10-02 | Semiconductor switching element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5651864A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629726A (en) * | 1985-07-09 | 1987-01-17 | Teisan Diecast Kogyo Kk | Punching and forming method for ring plate-shaped casting |
| JPS6442559A (en) * | 1987-08-07 | 1989-02-14 | Ube Industries | Heat treatment of aluminum alloy |
-
1979
- 1979-10-02 JP JP12767279A patent/JPS5651864A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629726A (en) * | 1985-07-09 | 1987-01-17 | Teisan Diecast Kogyo Kk | Punching and forming method for ring plate-shaped casting |
| JPS6442559A (en) * | 1987-08-07 | 1989-02-14 | Ube Industries | Heat treatment of aluminum alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6148788B2 (en) | 1986-10-25 |
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