JPS5653368U - - Google Patents

Info

Publication number
JPS5653368U
JPS5653368U JP1979134857U JP13485779U JPS5653368U JP S5653368 U JPS5653368 U JP S5653368U JP 1979134857 U JP1979134857 U JP 1979134857U JP 13485779 U JP13485779 U JP 13485779U JP S5653368 U JPS5653368 U JP S5653368U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979134857U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979134857U priority Critical patent/JPS5653368U/ja
Publication of JPS5653368U publication Critical patent/JPS5653368U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1979134857U 1979-09-29 1979-09-29 Pending JPS5653368U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979134857U JPS5653368U (cs) 1979-09-29 1979-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979134857U JPS5653368U (cs) 1979-09-29 1979-09-29

Publications (1)

Publication Number Publication Date
JPS5653368U true JPS5653368U (cs) 1981-05-11

Family

ID=29366414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979134857U Pending JPS5653368U (cs) 1979-09-29 1979-09-29

Country Status (1)

Country Link
JP (1) JPS5653368U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353555U (cs) * 1989-09-27 1991-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353555U (cs) * 1989-09-27 1991-05-23

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