JPS5664444A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5664444A JPS5664444A JP14059679A JP14059679A JPS5664444A JP S5664444 A JPS5664444 A JP S5664444A JP 14059679 A JP14059679 A JP 14059679A JP 14059679 A JP14059679 A JP 14059679A JP S5664444 A JPS5664444 A JP S5664444A
- Authority
- JP
- Japan
- Prior art keywords
- treated
- stable
- 60min
- approx
- quasi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Landscapes
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To obtain a semiconductor device having preferable characteristics by forming a thin film on an active element region, heat treating it, then irradiating predetermined amounts of charged particle beam, ionizing radiation and electromagnetic wave thereto and again heat treating it at a predetermined temperature. CONSTITUTION:After a predetermined amount of impurity diffused layer is formed, a wiring aluminum 6 is evaporated by an electron beam evaporating process, is then heat treated, thereby conducting an ohmic contact therebetween. Subsequently, an SiO2 film 7 is formed by sputtering, and is selectively opened with windows 8. Successively, it is heat treated at 400-550 deg.C for approx. 60min, and an X-rays are then irradiated in the amount of 20-20mrad in integration using a W bulb. Eventually, it is treated at 300-500 deg.C for approx. 60min. According to this configuration unstable residual defect can be converted into quasi-stable state by the initial treatment, the stable and quasi-stable defects can be simultaneously and uniformly dispersed by the irradiation of the X-rays, thereafter it is treated at low temperature causing no thermal inductive defect, thereby conducting rearray of lattice on the surface and in the boundary thereof. Accordingly, its electric characteristics can be remarkably improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059679A JPS5664444A (en) | 1979-10-31 | 1979-10-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059679A JPS5664444A (en) | 1979-10-31 | 1979-10-31 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5664444A true JPS5664444A (en) | 1981-06-01 |
| JPS6119103B2 JPS6119103B2 (en) | 1986-05-15 |
Family
ID=15272366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14059679A Granted JPS5664444A (en) | 1979-10-31 | 1979-10-31 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5664444A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433920A (en) * | 1977-08-19 | 1979-03-13 | Sharp Corp | Carburetor |
-
1979
- 1979-10-31 JP JP14059679A patent/JPS5664444A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433920A (en) * | 1977-08-19 | 1979-03-13 | Sharp Corp | Carburetor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119103B2 (en) | 1986-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4465529A (en) | Method of producing semiconductor device | |
| GB1205288A (en) | Method of fabricating a semiconductor device | |
| IE802151L (en) | Semiconductors | |
| US3600797A (en) | Method of making ohmic contacts to semiconductor bodies by indirect ion implantation | |
| US3390019A (en) | Method of making a semiconductor by ionic bombardment | |
| JPH02152226A (en) | Manufacture of semiconductor device | |
| JPS55162224A (en) | Preparation of semiconductor device | |
| US3938178A (en) | Process for treatment of semiconductor | |
| JPS6250972B2 (en) | ||
| JPS6250971B2 (en) | ||
| GB1228754A (en) | ||
| JPS5897863A (en) | Manufacture of semiconductor device | |
| JPS57177530A (en) | Processing of semiconductor wafer | |
| JPS6175517A (en) | Compound semiconductor substrate annealing method | |
| JPS55111170A (en) | Method of manufacturing semiconductor device | |
| Ardyshev et al. | Effect of radiation annealing on activation of silicon implanted in gallium arsenide | |
| JPS63119527A (en) | Manufacture of semiconductor device | |
| JPS5632745A (en) | Semiconductor device and manufacture thereof | |
| JPS5681935A (en) | Semiconductor device and its manufacture | |
| JPS57117278A (en) | Manufacture of semiconductor device | |
| JPS55163846A (en) | Manufacture of semiconductor device | |
| JPS6030112B2 (en) | Transistor manufacturing method | |
| SU381300A1 (en) | Method of annealing of radiation defects in semiconductor | |
| JPS62271420A (en) | Treatment equipment for semiconductor substrate | |
| JPS5617026A (en) | Manufacture of semiconductor device |