JPS5670650U - - Google Patents
Info
- Publication number
- JPS5670650U JPS5670650U JP1979152352U JP15235279U JPS5670650U JP S5670650 U JPS5670650 U JP S5670650U JP 1979152352 U JP1979152352 U JP 1979152352U JP 15235279 U JP15235279 U JP 15235279U JP S5670650 U JPS5670650 U JP S5670650U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979152352U JPS5670650U (mo) | 1979-10-31 | 1979-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979152352U JPS5670650U (mo) | 1979-10-31 | 1979-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5670650U true JPS5670650U (mo) | 1981-06-11 |
Family
ID=29383238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979152352U Pending JPS5670650U (mo) | 1979-10-31 | 1979-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5670650U (mo) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62247555A (ja) * | 1986-04-18 | 1987-10-28 | Ibiden Co Ltd | 半導体素子搭載ピングリットアレイパッケージ基板の製造方法 |
| WO2012092994A1 (de) * | 2011-01-05 | 2012-07-12 | Robert Bosch Gmbh | Elektronische baugruppe mit verbessertem thermo-management |
-
1979
- 1979-10-31 JP JP1979152352U patent/JPS5670650U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62247555A (ja) * | 1986-04-18 | 1987-10-28 | Ibiden Co Ltd | 半導体素子搭載ピングリットアレイパッケージ基板の製造方法 |
| WO2012092994A1 (de) * | 2011-01-05 | 2012-07-12 | Robert Bosch Gmbh | Elektronische baugruppe mit verbessertem thermo-management |