JPS5674119A - Curable heat-resistant resin composition - Google Patents
Curable heat-resistant resin compositionInfo
- Publication number
- JPS5674119A JPS5674119A JP14995279A JP14995279A JPS5674119A JP S5674119 A JPS5674119 A JP S5674119A JP 14995279 A JP14995279 A JP 14995279A JP 14995279 A JP14995279 A JP 14995279A JP S5674119 A JPS5674119 A JP S5674119A
- Authority
- JP
- Japan
- Prior art keywords
- reaction product
- resin composition
- acid dianhydride
- resistant resin
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 229920006015 heat resistant resin Polymers 0.000 title abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 4
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 abstract 3
- 239000004215 Carbon black (E152) Substances 0.000 abstract 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 abstract 2
- 238000007259 addition reaction Methods 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229930195733 hydrocarbon Natural products 0.000 abstract 2
- 150000002430 hydrocarbons Chemical class 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 abstract 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 abstract 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 238000009835 boiling Methods 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: A curable heat-resistant resin composition having improved flexibility, and prepared by reacting an addition reaction product between an N,N'-substituted bismaleimide and a primary monoamine compound with a tetracarboxylic acid dianhydride, and incorporating an epoxy resin with the reaction product thus obtained.
CONSTITUTION: An N,N'-ethylenebismaleimide of formula I (R1 is a bifunctional hydrocarbon) is dissolved in a low-boiling solvent, e.g. dioxane, and subjected to the addition reaction with a primary monoamine compound, e.g. methylamine, of formula II (R2 is monofunctional hydrocarbon or a monofunctional heterocyclic residue containing oxygen, etc.) at a molar ratio of preferably 1:1. The resultant reaction product thus obtained is then reacted with a carboxylic acid dianhydride, e.g. pyromellitic acid dianhydride, at a molar ratio of preferably 2:1. The reaction product thus obtained is then incorporated with an epoxy resin having preferably two epoxy groups in the molecule at a chemical equivalent ratio between the carboxyl groups and the epoxy groups of preferably 1:1 to give the aimed resin composition.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14995279A JPS5674119A (en) | 1979-11-21 | 1979-11-21 | Curable heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14995279A JPS5674119A (en) | 1979-11-21 | 1979-11-21 | Curable heat-resistant resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5674119A true JPS5674119A (en) | 1981-06-19 |
Family
ID=15486168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14995279A Pending JPS5674119A (en) | 1979-11-21 | 1979-11-21 | Curable heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5674119A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823007A (en) * | 1981-08-03 | 1983-02-10 | Nippon Telegr & Teleph Corp <Ntt> | Reinforcing method for connected part of optical fiber core |
-
1979
- 1979-11-21 JP JP14995279A patent/JPS5674119A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823007A (en) * | 1981-08-03 | 1983-02-10 | Nippon Telegr & Teleph Corp <Ntt> | Reinforcing method for connected part of optical fiber core |
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