JPS5683140A - Structure of housing for radio equipment - Google Patents
Structure of housing for radio equipmentInfo
- Publication number
- JPS5683140A JPS5683140A JP15995579A JP15995579A JPS5683140A JP S5683140 A JPS5683140 A JP S5683140A JP 15995579 A JP15995579 A JP 15995579A JP 15995579 A JP15995579 A JP 15995579A JP S5683140 A JPS5683140 A JP S5683140A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- amplifier
- thermal conductive
- conductive compound
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Transceivers (AREA)
- Structure Of Receivers (AREA)
Abstract
PURPOSE:To improve the heat dissipation effect and to make small the size of a housing, by mounting a high frequency power amplifier on the outer surface of the metal-made housing containing a small signal circuit via thermal conductive compound, and fitting the heat sink having the recess covering the amplifier to the housing with thermal conductive compound. CONSTITUTION:A small signal circuit 2 and a low-pass filter 4 are contained in the metal-made housing 5 separately with a partition 8, a control section 1 is fitted in front of the housing 5, and a high-frequency power amplifier 3 is fitted along the outer wall at the back side. In this case, location is made that the heat dissipation part of the amplifier 3 is closely attached to the outer side of the housing 5 via thermal conductive compound. Further, the heat sink 6b having the recess which can cover the amplifier 3 is fitted closely to the rear outer wall surface of the housing 5 via thermal conductive compound by covering the amplifier 3. Further, the heat produced from the amplifier 3 is effectively dissipated to make small the size of the housing 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15995579A JPS5683140A (en) | 1979-12-10 | 1979-12-10 | Structure of housing for radio equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15995579A JPS5683140A (en) | 1979-12-10 | 1979-12-10 | Structure of housing for radio equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5683140A true JPS5683140A (en) | 1981-07-07 |
Family
ID=15704811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15995579A Pending JPS5683140A (en) | 1979-12-10 | 1979-12-10 | Structure of housing for radio equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5683140A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107243U (en) * | 1984-12-20 | 1986-07-08 |
-
1979
- 1979-12-10 JP JP15995579A patent/JPS5683140A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107243U (en) * | 1984-12-20 | 1986-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2387743A (en) | Radiating enclosure | |
| JPH10256777A (en) | High-frequency emi shield accompanied with air flow for enclosure of electronic apparatus | |
| USD249475S (en) | Electronic thermometer housing | |
| SE9701417L (en) | Shield casing and method of making a casing | |
| DE60116666D1 (en) | INTERFERENCE REDUCTION USING LEADING THERMOPLASTIC COMPOSITE MATERIALS | |
| JPS57169644A (en) | Semiconductor type pressure sensor | |
| JPS5555601A (en) | Integrated circuit device for microwaves | |
| US3128431A (en) | Miniature radio transmitter | |
| GB2148051B (en) | Housing arrangement for an electronic component operable at low temperatures | |
| GB1266675A (en) | ||
| GB1045320A (en) | Portable transmitter-receiver | |
| JPS57152295A (en) | Bass-reflex type speaker system | |
| USD249249S (en) | Control unit housing for an electrical protection system | |
| KR100511669B1 (en) | Power supply | |
| JPS5683137A (en) | Structure of housing for radio equipment | |
| JPS5467355A (en) | Band pass filter | |
| USD273783S (en) | Explosion-proof housing for electrical circuit components | |
| JPS5423448A (en) | Microwave filter | |
| IE41290B1 (en) | Improvements in or relating to housings for electrical communications devices | |
| JPS53101248A (en) | Low-frequency power amplifier | |
| JP4331353B2 (en) | Heat dissipation structure of CATV booster | |
| JPS53126918A (en) | Speaker system | |
| JPS53105319A (en) | Highly density mounting frame for electronic components | |
| FR2423944A1 (en) | Bass reflex loudspeaker cabinet - has area of openings as function of cabinet volume and resonant frequency for ventilation of power circuits | |
| JPS56133634A (en) | Pyroelectric detector |