JPS5687663A - Thin film forming method - Google Patents

Thin film forming method

Info

Publication number
JPS5687663A
JPS5687663A JP16375679A JP16375679A JPS5687663A JP S5687663 A JPS5687663 A JP S5687663A JP 16375679 A JP16375679 A JP 16375679A JP 16375679 A JP16375679 A JP 16375679A JP S5687663 A JPS5687663 A JP S5687663A
Authority
JP
Japan
Prior art keywords
target
thin film
electrode
film forming
forming method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16375679A
Other languages
Japanese (ja)
Inventor
Masaki Kobayakawa
Kiyohisa Kato
Shigeru Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Kagoshima Ltd
NEC Kagoshima Ltd
Original Assignee
Nippon Electric Kagoshima Ltd
NEC Kagoshima Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Kagoshima Ltd, NEC Kagoshima Ltd filed Critical Nippon Electric Kagoshima Ltd
Priority to JP16375679A priority Critical patent/JPS5687663A/en
Publication of JPS5687663A publication Critical patent/JPS5687663A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To stabilize the electric resistance of an electrically conductive thin film in the formation of the film by fixing a target on an electrode with a different metal layer inbetween to prevent the electrode material from diffusing in the target material. CONSTITUTION:Electrode 1 of copper of the like is plated with third metal 3 such as Ni, and target 2 of tin or the like is attached to metal 3. By forming an electrically conductive thin film on a glass surface or the like by the ion bombardment of this target 2, the electric resistance of the thin film is stabilized to smoothen the work. In addition, electrode material 1 is prevented from diffusing in target material 2 as an impurity, so target 2 can be used efficiently.
JP16375679A 1979-12-17 1979-12-17 Thin film forming method Pending JPS5687663A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16375679A JPS5687663A (en) 1979-12-17 1979-12-17 Thin film forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16375679A JPS5687663A (en) 1979-12-17 1979-12-17 Thin film forming method

Publications (1)

Publication Number Publication Date
JPS5687663A true JPS5687663A (en) 1981-07-16

Family

ID=15780095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16375679A Pending JPS5687663A (en) 1979-12-17 1979-12-17 Thin film forming method

Country Status (1)

Country Link
JP (1) JPS5687663A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02267261A (en) * 1989-04-06 1990-11-01 Kojundo Chem Lab Co Ltd Production of target for sputtering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02267261A (en) * 1989-04-06 1990-11-01 Kojundo Chem Lab Co Ltd Production of target for sputtering

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