JPS568860A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS568860A
JPS568860A JP8359279A JP8359279A JPS568860A JP S568860 A JPS568860 A JP S568860A JP 8359279 A JP8359279 A JP 8359279A JP 8359279 A JP8359279 A JP 8359279A JP S568860 A JPS568860 A JP S568860A
Authority
JP
Japan
Prior art keywords
wall
refrigerant
semiconductor
semiconductor element
apex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8359279A
Other languages
Japanese (ja)
Inventor
Kazuo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8359279A priority Critical patent/JPS568860A/en
Publication of JPS568860A publication Critical patent/JPS568860A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To achieve an effective cooling of a semiconductor element by constructing the inside wall of a device opposing to a semiconductor element making a smooth inclination toward the circumference from the top of the semiconductor, which is regarded as an apex. CONSTITUTION:The wall 21 opposing to a semiconductor element 26 has an apex on the upper section of the semiconductor element 26 and it is making a smooth inclination toward the circumference. The heat generated at the element 26 evaporates a refrigerant 27 toward the direction of an arrow 29. This evaporated refrigerant comes in contact with a wall 21 and adhered to the wall 21 as a liquefied refrigerant before evaporation. In such way, the refrigerant which is liquefied by contacting the wall 21 does not drop on the surface of the element 26 and the fine metal wire 22. Accordingly, the element 26 can be cooled without giving a bad influence to the semiconductor device.
JP8359279A 1979-07-02 1979-07-02 Semiconductor device Pending JPS568860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8359279A JPS568860A (en) 1979-07-02 1979-07-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8359279A JPS568860A (en) 1979-07-02 1979-07-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS568860A true JPS568860A (en) 1981-01-29

Family

ID=13806753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8359279A Pending JPS568860A (en) 1979-07-02 1979-07-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS568860A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864055A (en) * 1981-10-14 1983-04-16 Fujitsu Ltd Liquid-cooled module
US7156158B2 (en) * 1997-10-20 2007-01-02 Fujitsu Limited Heat pipe type cooler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864055A (en) * 1981-10-14 1983-04-16 Fujitsu Ltd Liquid-cooled module
US7156158B2 (en) * 1997-10-20 2007-01-02 Fujitsu Limited Heat pipe type cooler
US7721789B2 (en) 1997-10-20 2010-05-25 Fujitsu Limited Heat pipe type cooler

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