JPS5690568A - Semiconductor device for photoelectric transducer - Google Patents
Semiconductor device for photoelectric transducerInfo
- Publication number
- JPS5690568A JPS5690568A JP16669379A JP16669379A JPS5690568A JP S5690568 A JPS5690568 A JP S5690568A JP 16669379 A JP16669379 A JP 16669379A JP 16669379 A JP16669379 A JP 16669379A JP S5690568 A JPS5690568 A JP S5690568A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- wafer
- photoelectric transducer
- image
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To provide a low cost photoelectric transducer device by a method wherein a lens for making an image at a photoelectric transducer part is integrally molded by a transparent resin when a wafer is molded. CONSTITUTION:P type layer 2 is made at N type Si wafer 1, and the desired circuits 3 are placed at the right and left sides of the layer 2. After the photodiode parts are connected to the circuits 3, a front surface of the wafer 1 is selectively covered by SiO2 film 4, a light shield mask 5 is applied to restrict a light receiving surface and thereby the circuits 3 are shielded against the light. The image is made at the input/output pin 6 under the mask 5 and SiO2 film 4. Then, when the device is molded by a transparent epoxy resin 7, the lens 8 is integrally molded and the image is made on the photodiode. The part of the top surface of the resin 7 other than the lens 8 is covered by the light shield layer 9. The arrangement is simple in its construction and no lens fixing operation is required, no displacement of the lens is found to reduce a cost for the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16669379A JPS5690568A (en) | 1979-12-21 | 1979-12-21 | Semiconductor device for photoelectric transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16669379A JPS5690568A (en) | 1979-12-21 | 1979-12-21 | Semiconductor device for photoelectric transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5690568A true JPS5690568A (en) | 1981-07-22 |
Family
ID=15835981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16669379A Pending JPS5690568A (en) | 1979-12-21 | 1979-12-21 | Semiconductor device for photoelectric transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5690568A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01176954U (en) * | 1988-06-01 | 1989-12-18 | ||
| US4920075A (en) * | 1982-06-15 | 1990-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a semiconductor device having a lens section |
| JP2002141518A (en) * | 2000-10-30 | 2002-05-17 | Seiko Instruments Inc | Structure and manufacturing method of semiconductor module |
| JP2002246613A (en) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | Optical function module and manufacturing method thereof |
| US7157302B2 (en) | 1998-06-04 | 2007-01-02 | Micron Technology, Inc. | Imaging device and method of manufacture |
| JP2011009408A (en) * | 2009-06-25 | 2011-01-13 | Ricoh Co Ltd | Electronic component module and manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5256776U (en) * | 1975-10-23 | 1977-04-23 | ||
| JPS534772U (en) * | 1976-06-30 | 1978-01-17 |
-
1979
- 1979-12-21 JP JP16669379A patent/JPS5690568A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5256776U (en) * | 1975-10-23 | 1977-04-23 | ||
| JPS534772U (en) * | 1976-06-30 | 1978-01-17 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4920075A (en) * | 1982-06-15 | 1990-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a semiconductor device having a lens section |
| JPH01176954U (en) * | 1988-06-01 | 1989-12-18 | ||
| US7157302B2 (en) | 1998-06-04 | 2007-01-02 | Micron Technology, Inc. | Imaging device and method of manufacture |
| JP2002141518A (en) * | 2000-10-30 | 2002-05-17 | Seiko Instruments Inc | Structure and manufacturing method of semiconductor module |
| JP2002246613A (en) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | Optical function module and manufacturing method thereof |
| JP2011009408A (en) * | 2009-06-25 | 2011-01-13 | Ricoh Co Ltd | Electronic component module and manufacturing method |
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