JPS5690961A - Continuous hot dipping method of metal wire - Google Patents

Continuous hot dipping method of metal wire

Info

Publication number
JPS5690961A
JPS5690961A JP16892279A JP16892279A JPS5690961A JP S5690961 A JPS5690961 A JP S5690961A JP 16892279 A JP16892279 A JP 16892279A JP 16892279 A JP16892279 A JP 16892279A JP S5690961 A JPS5690961 A JP S5690961A
Authority
JP
Japan
Prior art keywords
metal
wires
water
water film
passed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16892279A
Other languages
Japanese (ja)
Inventor
Shigeichi Asazato
Shoichi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HIMEJIMA DOUSEN KK
Original Assignee
HIMEJIMA DOUSEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HIMEJIMA DOUSEN KK filed Critical HIMEJIMA DOUSEN KK
Priority to JP16892279A priority Critical patent/JPS5690961A/en
Publication of JPS5690961A publication Critical patent/JPS5690961A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/38—Wires; Tubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To dry metal wires easily without requiring moisture removing process after the hot dipping by passing the hot dipped metal wires through a curtainlike water film to cool the same and controlling the degree of cooling at the time of metal hot dipping the metal wires. CONSTITUTION:After a plurality of metal wires 1 are passed through a pretreatment cell 2 and are thereby cleaned of their surfaces, they are passed through a flux cell 3, then through the inside of a metal hot dippng cell 4 of Zn, Sn, Pb or the like, whereby the surfaces are metal hot dipped. The excess stuck plating metal is removed with drawing dies 5, after which the wires are passed through a curtainlike water film 6, whereby the plated wires 1 are cooled. The water film is formed by ejecting the water through the slits 8 provided to a pipe 7 made of rigid PVC, thereby allowing the water to fall. The controlling of the rate of cooling of the wires 1 is accmplished by controlling the cooling capacity for each unit by adjusting the width, water pressure, etc. of the slits 8 and changing the passage times of the water film 6. It is so controlled that moisture is completely removed and dried by the heat retained by the metal wires 1.
JP16892279A 1979-12-24 1979-12-24 Continuous hot dipping method of metal wire Pending JPS5690961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16892279A JPS5690961A (en) 1979-12-24 1979-12-24 Continuous hot dipping method of metal wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16892279A JPS5690961A (en) 1979-12-24 1979-12-24 Continuous hot dipping method of metal wire

Publications (1)

Publication Number Publication Date
JPS5690961A true JPS5690961A (en) 1981-07-23

Family

ID=15877035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16892279A Pending JPS5690961A (en) 1979-12-24 1979-12-24 Continuous hot dipping method of metal wire

Country Status (1)

Country Link
JP (1) JPS5690961A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070237A (en) * 1973-06-28 1975-06-11
JPS50137809A (en) * 1974-04-24 1975-11-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5070237A (en) * 1973-06-28 1975-06-11
JPS50137809A (en) * 1974-04-24 1975-11-01

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