JPS5698244A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5698244A
JPS5698244A JP105680A JP105680A JPS5698244A JP S5698244 A JPS5698244 A JP S5698244A JP 105680 A JP105680 A JP 105680A JP 105680 A JP105680 A JP 105680A JP S5698244 A JPS5698244 A JP S5698244A
Authority
JP
Japan
Prior art keywords
polyfunctional
prepolymer
combined
cyanate ester
polybutadiene resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP105680A
Other languages
Japanese (ja)
Other versions
JPS6328099B2 (en
Inventor
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP105680A priority Critical patent/JPS5698244A/en
Publication of JPS5698244A publication Critical patent/JPS5698244A/en
Publication of JPS6328099B2 publication Critical patent/JPS6328099B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

PURPOSE: A specific polybutadiene resin, a polyfunctional cyanate ester and a polyfunctional maleimide are combined to produce the titled composition with high flexibility and elasticity as well as excellent heat and humid resistance.
CONSTITUTION: A polybutadiene resin bearing hydroxyls or carboxyls on chain terminals or its hydrogenation product is combined with a polyfunctional cyanate ester or its prepolymer, preferably of 400W6,000 average molecular weight, and a polyfunctional maleimide or its prepolymer in the form of a simple mixture or prereaction product. Further, an epoxy resin is added, when necessary, to increase the adhesion and control the viscosity. The resultant composition forms chemical bonds and cross-linking networks by itself with heat, however, the addition of a catalyst is preferred such as an imidazole or tertiary amine.
COPYRIGHT: (C)1981,JPO&Japio
JP105680A 1980-01-09 1980-01-09 Curable resin composition Granted JPS5698244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP105680A JPS5698244A (en) 1980-01-09 1980-01-09 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP105680A JPS5698244A (en) 1980-01-09 1980-01-09 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5698244A true JPS5698244A (en) 1981-08-07
JPS6328099B2 JPS6328099B2 (en) 1988-06-07

Family

ID=11490879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP105680A Granted JPS5698244A (en) 1980-01-09 1980-01-09 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5698244A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271341A (en) * 1985-05-27 1986-12-01 Mitsubishi Gas Chem Co Inc How to stabilize rubber
JPH04366146A (en) * 1991-06-13 1992-12-18 Shin Kobe Electric Mach Co Ltd Cyanic seter resin composition
JP2016135859A (en) * 2015-01-16 2016-07-28 日立化成株式会社 Thermosetting resin composition, resin film for interlayer insulation, resin film with adhesive auxiliary layer for interlayer insulation and printed wiring board
WO2018139368A1 (en) * 2017-01-26 2018-08-02 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271341A (en) * 1985-05-27 1986-12-01 Mitsubishi Gas Chem Co Inc How to stabilize rubber
JPH04366146A (en) * 1991-06-13 1992-12-18 Shin Kobe Electric Mach Co Ltd Cyanic seter resin composition
JP2016135859A (en) * 2015-01-16 2016-07-28 日立化成株式会社 Thermosetting resin composition, resin film for interlayer insulation, resin film with adhesive auxiliary layer for interlayer insulation and printed wiring board
US10544305B2 (en) 2015-01-16 2020-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
WO2018139368A1 (en) * 2017-01-26 2018-08-02 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board
JPWO2018139368A1 (en) * 2017-01-26 2019-02-07 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
US11166370B2 (en) 2017-01-26 2021-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Also Published As

Publication number Publication date
JPS6328099B2 (en) 1988-06-07

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